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Fabricating Nanocomposite Catalysts through Interfacial Fusion of Metallic Nanoparticles

Published online by Cambridge University Press:  31 January 2011

Yong-Jae Choi
Affiliation:
ychoi2@ncsu.edu, NC State University, Raleigh, North Carolina, United States
Tsan-Yao Chen
Affiliation:
tchen6@ncsu.edu, NC State University, Raleigh, North Carolina, United States
Chi-Kai Chiu
Affiliation:
cchiu3@ncsu.edu, NC State University, Raleigh, North Carolina, United States
Tzy-Jiun Mark Luo
Affiliation:
Mark_Luo@ncsu.edu
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Abstract

Fusion of metallic nanoparticles at both surfaces of silica colloids and nanoporous bulk materials has been utilized as an effective method to integrate inorganic and organic components into nanocomposite materials. When performed on substrates that have been modified with hydrophobic functional groups, aminosilica colloids doped with metallic nanoparticles through the ethylenediamine functional groups adhere to the substrates and self-assemble into nanocomposite film with its thickness to be the function of the time. On the contrary, without metal-bound functional groups, fusion of metallic nanoparticles can be induced at the interface of nanoporous silica when polymer is utilized as the mobile phase for metal nanoparticles inside of silica. Formation, mobilization, and fusion of metallic nanoparticles within the polymer phase can be simultaneously induced at 160 ˚C, during which reactions alter the physical appearance of the materials from transparent to silver metallic color. These two methods can combine with soft-lithography method to create functional structures that exhibit enhanced electrochemical property.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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References

(1) Wu, F. C.; Chen, T. Y.; Wan, C. C.; Wang, Y. Y.; Lin, T. L. Electrochemical and Solid State Letters 2006, 9, A549A551.Google Scholar
(2) Yu, K. M. K.; Yeung, C. M. Y.; Thompsett, D.; Tsang, S. C. J. Phys. Chem. B 2003, 107, 45154526.Google Scholar
(3) Choi, Y. J.; Huh, U.; Luo, T T. J. M. Journal of Sol Sol-Gel Science and Technology 2009, 51, 124132.Google Scholar
(4) Gao, Y.; Jiang, P.; Song, L.; Liu, L. F.; Yan, X. Q.; Zhou, Z. Q.; Liu, D. F.; Wang, J. X.; Yuan, H. J.; Zhang, Z. X.; Zhao, X. W.; Dou, X. Y.; Zhou, W. Y.; Wang, G.; Xie, S. S. Journal of Physics D-Applied Physics 2005, 38, 10611067.Google Scholar
(5) Luo, C.; Zhang, Y.; Zeng, X.; Zeng, Y.; Wang, Y. Journal of Colloid and Interface Science 2005, 288, 444448.Google Scholar
(6) Moon, K. S.; Dong, H.; Maric, R.; Pothukuchi, S.; Hunt, A.; Li, Y.; Wong, C. P. Journal of Electronic Materials 2005, 34, 168175.Google Scholar
(7) Xia, Y. N.; Whitesides, G. M. Annu. Rev. Mater. Sci. 1998, 28, 153184.Google Scholar
(8) Arnold, G. W.; Borders, J. A. J. Appl. Phys. 1977, 48, 14881496.Google Scholar