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Epitaxial Growth of SiC on Non-Typical Orientations and MOS Interfaces

Published online by Cambridge University Press:  21 March 2011

Hiroyuki Matsunami
Affiliation:
Department of Electronic Science and Engineering, Kyoto University Yoshidahonmachi, Sakyo, Kyoto 606-8501, Japan
Tsunenobu Kimoto
Affiliation:
Department of Electronic Science and Engineering, Kyoto University Yoshidahonmachi, Sakyo, Kyoto 606-8501, Japan
Hiroshi Yano
Affiliation:
Department of Electronic Science and Engineering, Kyoto University Yoshidahonmachi, Sakyo, Kyoto 606-8501, Japan
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Abstract

High-quality 4H-SiC has been epitaxially grown on (1120) substrates by chemical vapor deposition. The physical properties of epilayers and MOS interfaces on both (1120) and off-axis (0001) substrates are elucidated. An unintentionally doped 4H-SiC epilayer on (1120) shows a donor concentration of 1×1014 cm−3 with a total trap concentration as low as 3.8×1012 cm−3. Inversion-type planar MOSFETs fabricated on 4H-SiC (1120) exhibit a high channel mobility of 96 cm2/Vs. The channel mobility decreases according to the T−2.2 dependence above 200K, indicating reduced Coulomb scattering and/or electron trapping. The superior MOS interface on (1120) originates from the much lower interface state density near the conduction band edge.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

[1] Neudeck, P.G. and Powell, J.A., IEEE Electron Device Lett. 15, 63(1994).Google Scholar
[2] Takahashi, J. and Ohtani, N., Phys. Stat. Sol. (b) 202, 163(1997).Google Scholar
[3] Burk, A.A. Jr, Barrett, D.L., Hobgood, H.M., Siergiej, R.R., Braggins, T.T., Clarke, R.C., Eldridge, G.W., Brandt, C.D., Larkin, D.J., Powell, J.A., and Choyke, W.J., Silicon Carbide and Related Materials (IOP, Bristol, 1994), p.29.Google Scholar
[4] Hallin, C., Ellison, A., Ivanov, I.G., Henry, A., Son, N.T., and Janzen, E., Mat. Sci. Forum 264268, 123(1998).Google Scholar
[5] Kimoto, T., Yamamoto, T., Chen, Z.Y., Yano, H., and Matsunami, H., Mat. Sci. Forum 338342, 189(2000).Google Scholar
[6] Agarwal, A.K., Casady, J.B., Rowland, L.B., Valek, W.F., White, M.H., and Brandt, C.D., IEEE Electron Device Lett. 18, 586(1997).Google Scholar
[7] Spitz, J., Melloch, M.R., Cooper, J.A. , Jr., and Capano, M.A., IEEE Electron Device Lett. 19, 100(1998).Google Scholar
[8] Sugawara, Y. and Asano, K., Proc. of the 10th Int. Symp. Power Semicond. Devices & Ics (Kyoto, 1998), p.119.Google Scholar
[9] Yano, H., Hirao, T., Kimoto, T., Matsunami, H., Asano, K., and Sugawara, Y., IEEE Electron Device Lett. 20, 611(1999).Google Scholar
[10] Matsunami, H. and Kimoto, T., Mat. Sci. & Eng. R20, 125(1997).Google Scholar
[11] Chen, Z.Y., Kimoto, T., and Matsunami, H., Jpn. J. Appl. Phys. 38, L1375(1999).Google Scholar
[12] Larkin, D.J., Neudeck, P.G., Powell, J.A., and Matus, L.G., Appl. Phys. Lett. 65, 1659(1994).Google Scholar
[13] Okushi, H. and Tokumaru, Y., Jpn. J. Appl. Phys. Suppl. 20–1, 261 (1981).Google Scholar
[14] Dalibor, T., Pensl, G., Matsunami, H., Kimoto, T., Choyke, W.J., Schöner, A., and Nordell, N., Phys. Stat. Sol. (a) 162, 199(1997).Google Scholar
[15] Yano, H., Hirao, T., Kimoto, T., Matsunami, H., Asano, K., and Sugawara, Y., Mat. Sci. Forum 338–342, 1105(2000).Google Scholar
[16] Schadt, M., Pensl, G., Devaty, R.P., Choyke, W.J., Stein, R., and Stephani, D., Appl. Phys. Lett. 65, 3120(1994).Google Scholar
[17] Saks, N.S., Mani, S.S., Agarwal, A.K., and Hegde, V.S., Mat. Sci. Forum 338–342, 737(2000).Google Scholar
[18] Yano, H., Kimoto, T., and Matsunami, H., Late News Abstracts of 3rd European Conf. on Silicon Carbide and Related Materials (Kloster Banz, 2000), p.10.Google Scholar
[19] Shenoy, J.N., Das, M.K., Cooper, J.A. , Jr., Melloch, M.R., and Palmour, J.W., J. Appl. Phys. 79, 3042(1996).Google Scholar
[20] Bassler, M., Afanas'ev, V., Pensl, G., and Schulz, M., Mat. Sci. Forum 338–342, 1065(2000).Google Scholar
[21] Pensl, G., Bassler, M., Ciobanu, F., Afanas'ev, V., Yano, H., Kimoto, T., and Matsunami, H., in this volume.Google Scholar
[22] Yano, H., Katafuchi, F., Kimoto, T., and Matsunami, H., IEEE Trans. Electron Devices 46, 504(1999).Google Scholar
[23] Schörner, R., Friedrichs, P., and Peters, D., IEEE Trans. Electron Devices 46, 533(1999).Google Scholar
[24] Afanas'ev, V.V., Bassler, M., Pensl, G., and Schulz, M., Phys. Stat. Sol. (a) 162, 321(1997).Google Scholar