Hostname: page-component-7bb8b95d7b-lvwk9 Total loading time: 0 Render date: 2024-09-26T12:42:40.427Z Has data issue: false hasContentIssue false

Electron work function at grain boundary and the corrosion behavior of nanocrystalline metallic materials

Published online by Cambridge University Press:  26 February 2011

D. Y. Li*
Affiliation:
dongyang.li@ualberta.ca, University of Alberta, Chemical and Materials Engineering, Dept. of Chem. & Mater. Eng., University of Alberta, Edmonton, Alberta, T6G 2G6, Canada, (780) 492-6750, (780) 492-2881
Get access

Abstract

Due to their high grain boundary density, nanocrystalline materials possess unusual mechanical, physical and chemical properties. Extensive research on nanocrystalline materials has been conducted in recent years. Many studies have shown that corrosion, one of important properties of nanocrystalline materials, is crucial to their applications. In this article, the activity of electrons at grain boundaries of metallic surfaces is analyzed based the electron work function (EWF), the minimum energy required to attract electrons from inside a metal. It is demonstrated that at grain boundaries, the electron work function decreases, indicating that at a grain boundary, electrons are more active. As a result, the surface becomes more electrochemically reactive. Such increase in electrochemical reactivity has negative effect on the corrosion resistance of nanocrystalline materials. However, for a passive nanocrystalline metal or alloy, the nanocrystalline structure is beneficial to its corrosion resistance through rapid formation of a protective passive film. The mechanisms responsible for the variation in EWF at grain boundary and effects of nanocrystallization on corrosion are discussed in this article.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Rofagha, et al. , The corrosion behavior of nanocrystalline nickel, Scripta Metall. Mater., 25, 2867 (1991).Google Scholar
2. Inturi, R.B. and Szklarska-Smialowski, Z., Localized corrosion of nanocrystalline 304 type stainless steel films, Corrosion, 398 (1992).Google Scholar
3. Li, W. and Li, D.Y., Variations of work function and corrosion behaviors of deformed copper surfaces, Appl. Surf. Sci., 240, 388 (2005).Google Scholar
4. Marder, Michael P., Condensed Matter Physics, John Wiley & Sons, Inc., New York, 2000, PP. 519520.Google Scholar
5. Li, W. and Li, D.Y., Effect of grain size on the electron work function of Cu and Al, Surf. Rev. and Lett., 11, 173 (2004).Google Scholar
6. Tao, S. and Li, D.Y., Tribological, mechanical and electrochemical properties of nanocrystalline copper deposits produced by pulse electrodeposition, Nanotechnology, 17, 65 (2006).Google Scholar
7. Porter, D.A. and Easterling, K.E., Phase transformation in metals and alloys, 2nd edition, Chapman & Hall, London, 1992, Chapter 3.Google Scholar
8. Li, W. and Li, D.Y., Effects of Dislocation on the Electron Work Function of a Metal Surface, Mater. Sci. & Tech., 18, 1057 (2002).Google Scholar
9. Wang, X.Y. and Li, D.Y., Mechanical, electrochemical and tribological properties of nanocrystalline surface of 304 stainless steel, Wear, 255, 836 (2003).Google Scholar
10. Guan, X.S., Dong, Z.F. and Li, D.Y., Surface nanocrystallization by sandblasting and annealing for improved mechanical and tribological properties, Nanotechnology, 16, 2963 (2005).Google Scholar
11. Hamm, D., Olsson, C., & Landolt, D., Effect of chromium content and sweep rate on passive film growth on iron-chromium alloys studied by EQCM and XPS, Corro. Sci., 44, 1009 (2002).Google Scholar
12. Fujimoto, S., Shibata, T., & Yamada, T., Suppression of pitting corrosion with passive film modification on type 304 stainless steel by ultra-violet light irradiation, J. of the Japan Institute of Metals, 62, 527 (1998).Google Scholar
13. Stern, M, Geary, A L, J. Electrochem. Soc., 104, 56 (1957).Google Scholar
14. Baikie, I. D., Smish, P. J. S., Porterrfield, D. M., and Estrup, P. J., Multitip scanning bioKelvin probe Rev. Sci. Instrum., 70, 1842 (1999).Google Scholar
15. Li, W. and Li, D.Y., On the correlation between surface roughness and work function in copper, J. of Chem. Phys., 122, 064708 (2005).Google Scholar