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The Effect of Reaction Driving Force on Copper Nanoparticle Preparation by Liquid Phase Reduction Method

Published online by Cambridge University Press:  31 January 2011

Qingming Liu ,
Debi Zhou ,
Kazuaki Nishio ,
Salah Salman ,
Ryoichi Ichino  and
Masazumi Okido
Qingming Liu
Affiliation:
luisman@126.com, Nagoya University, Department of Materials Science, Nagoya, Japan
Debi Zhou
Affiliation:
zhoudb@mail.csu.edu.cn, Central South University, School of Chemistry and Chemical Engineering, Changsha, China
Kazuaki Nishio
Affiliation:
nishio@nagoya.co.jp, Nagoya University, Department of Materials Science, Nagoya, Japan
Salah Salman
Affiliation:
sa.salman@yahoo.com, Nagoya University, Department of Materials Science, Nagoya, Japan
Ryoichi Ichino
Affiliation:
ichino@numse.nagoya-u.ac.jp, Nagoya University, Department of Materials Science, Nagoya, Japan
Masazumi Okido
Affiliation:
okido@numse.nagoya-u.ac.jp, Nagoya University, Department of Materials Science, Nagoya, Japan
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Abstract

Copper nanoparticle was prepared by liquid phase reduction technique. Cu2+ was reduced to copper particle by adopting different types of reductants. Ascorbic acid (C6H8O6), phosphinic acid (H3PO2), titanium sulfate (Ti2(SO4)3) and sodium borohydride (NaBH4) were chosen as reductant, respectively. The effect of reaction driving force upon the average size of copper particle was investigated in the paper. It can be concluded that there is a firm relationship between the reaction driving force and the average size of copper particle. The average size of copper particle decreases with the increasing of reaction driving force.

Keywords

Cunanoscalepowder
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1207: Symposium N – Colloidal Nanoparticles for Electronic Applications — Light Emission, Detection, Photovoltaics and Transport , 2009 , 1207-N07-02
Copyright
Copyright © Materials Research Society 2010

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References

[1] Songping, Wu, Shuyuan, Meng, Materials Letters. 60 (20), 2438 (2006).Google Scholar
[2] Huang, Chien-Yu, Sheen, Shyang Roeng, Materials Letters. 30 (5-6), 357 (1997).Google Scholar
[3] Okamoto, Takeshi, Ichino, Ryoichi, Okido, Masazumi, Liu, Zhihong, Resource and Materials. 121, 255 (2005).Google Scholar
[4] Wu, Szu-Han and Chen, Dong-Hwang, Journal of Colloid and Interface Science. 273 (1), 165 (2004).Google Scholar
[5] Goia, Dan V. and Matijevic, Egon, New J. Chem. 22, 1203 (1998).Google Scholar
[6] Lu, Jianming, Dreisinger, D.B., Cooper, W.C., Hydrometallurgy. 45, 305 (1997).Google Scholar
[7] Marcel Pourbaix: Atlas of Electrochemical Equilibria in Aqueous Solutions. (Pergamon Press, Oxford, 1966), p. 384–386.Google Scholar