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Dynamic Hardness of Thin Films and its Thickness Dependence

Published online by Cambridge University Press:  10 February 2011

Mikio Iwasa
Affiliation:
Department of Materials Physics, Osaka National Research Institute, AIST, MITI Midorigaoka 1-8-31, Ikeda-shi, Osaka, 563 Japan, iwasa@onri.go.jp
Koji Tanaka
Affiliation:
Department of Materials Physics, Osaka National Research Institute, AIST, MITI Midorigaoka 1-8-31, Ikeda-shi, Osaka, 563 Japan, iwasa@onri.go.jp
John A. Barnard
Affiliation:
Department of Metallurgical and Materials Engineering, The University of Alabama, Box 870202, Tuscaloosa, Alabama 35487-0202
Richard C. Bradt
Affiliation:
Department of Metallurgical and Materials Engineering, The University of Alabama, Box 870202, Tuscaloosa, Alabama 35487-0202
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Abstract

Thin films of indium tin oxide, silica and chromium were deposited on the soda-lime-silica glass substrates with the thickness ranging from 50 to 2000 nano-meter. Their dynamic hardness were measured by the nano-indentation method with the indentation depth from 50 to 200 nano-meter. The hardness of indium tin oxide film increased and that of silica decreased with increasing film thickness. The hardness of chromium was almost constant regardless of film thickness. When the hardness of thin film was higher than that of substrate, the influence of substrate was greater compared with the reverse case. The dynamic hardness of engineering ceramics were about fifty percent higher than the ordinary Vickers hardness, but the ranking order was in good agreement. The Young's modulus from nano-indentation were a little higher than those by resonance method.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

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