Hostname: page-component-8448b6f56d-dnltx Total loading time: 0 Render date: 2024-04-18T04:45:21.215Z Has data issue: false hasContentIssue false

Dopant Site Location by Electron Channeling in Ion Implanted Silicon*

Published online by Cambridge University Press:  21 February 2011

S. J. Pennycook
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37830
J. Narayan
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37830
O.W. Holland
Affiliation:
Solid State Division, Oak Ridge National Laboratory, Oak Ridge, TN 37830
Get access

Abstract

A simple ratio technique using the phenomenon of electron channeling can be used to measure the substitutional concentrations of dopants in semiconductors on a submicron scale.A comparison was made between electron and ion channeling measurements on Si-Sb alloy samples having a range of nonsubstitutional fractions of Sb.Good agreement was obtained but both measurements indicated considerably more nonsubstitutional dopant than could be accounted for by precipitates observed in electron micrographs. The discrepancy can be explained if the precipitates are coherent in the early stages of growth and have their planes located interstitially with respect to the Si planes. The sensitivity of the electron channeling measurements to the implantation profile was investigated and found to be small.The determination of local dopant profiles in the electron microscope is described.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

*

Research sponsored by the Division of materials Sciences, U. S. Department of Energy under contract W–7405–eng–26 with Union Carbide Corporation.

References

REFERENCES

1. Appleton, B.R., p.97 in Defects in Semiconductors, ed.by Narayan, J. and Tan, T.Y., Elsevier, New York (1981).Google Scholar
2. Batterman, B.W., Phys.Rev.Lett. 22, 703 (1969).CrossRefGoogle Scholar
3. Cowan, P.L., Golovchenko, J.A. and Robbins, M.F., Phys.Rev.Lett. 44, 1680 (1980).CrossRefGoogle Scholar
4. Hirsch, P.B., Howie, A., Nicholson, R.B., Pashley, D.W. and Whelan, M.J., Electron Microscopy of Thin Crystals, Butterworth, London (1965).Google Scholar
5. Spence, J.C.H. and Tafto, J., p.523 in Scanning Electron Microscopy/ 1982/II, SEM Inc.AMF O'Hare, Ill.(1982).Google Scholar
6. Tafto, J. and Spence, J.C.H., Science 218, 49 (1982).CrossRefGoogle Scholar
7. Narayan, J. and Holland, O.W., Appl.Phys.Lett. 41, 239 (1982).CrossRefGoogle Scholar
8. Narayan, J. and Holland, O.W., Phys.Stat.Solidi (a) 73, 1225 (1982).Google Scholar
9. Pennycook, S.J., Narayan, J. and Holland, O. W., Appl. Phys. Lett., in press (1983).Google Scholar
10. Kelly, P.M., Jostons, A., Blake, R.G. and Napier, J.G., Phys.Stat.Sol.(a) 31, 771 (1975).CrossRefGoogle Scholar
11. Pennycook, S.J., Narayan, J. and Holland, O.W., in Ion Implantation and Ion Beam Processing of Materials, Proc.1983 MRS Meeting, in press.Google Scholar
12. Appleton, B.R., Narayan, J., White, C.W., Williams, J.S. and Short, K.T., Nucl.Instrum. and Methods 209/210, 239 (1982).CrossRefGoogle Scholar
13. Anderson, J.U., Andreasen, O., Davies, J.A. and Uggerhoj, E., Radiat. Eff. 7, 25 (1971).CrossRefGoogle Scholar
14. Pennycook, S.J., Narayan, J. and Holland, O.W., J.Appl.Phys.(in press).Google Scholar