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Dispersive Evaluation and Self-Sensing of Single Carbon Fiber/CNT-Epoxy Composites using Electro-Micromechanical Techniques

Published online by Cambridge University Press:  01 February 2011

Joung-Man Park ,
Jung-Hoon Jang ,
Zuojia Wang ,
Pyung-Gee Kim ,
Woo-Il Lee ,
Jong-Kyoo Park  and
Lawrence K. DeVries
Joung-Man Park
Affiliation:
jmpark@gnu.ac.kr, Gyeongsang National University, School of Nano and Advanced Materials Engineering, 900 Gajwa-Dong, Jinju, 660-701, Korea, Republic of, +82-55-751-5300, +82-55-752-0075
Jung-Hoon Jang
Affiliation:
hunj0425@empal.com, Gyeongsang National University, School of Nano and Advanced Materials Engineering, 900 Gajwa-Dong, Jinju, 660-701, Korea, Republic of
Zuojia Wang
Affiliation:
wangzj@empal.com, Gyeongsang National University, School of Nano and Advanced Materials Engineering, 900 Gajwa-Dong, Jinju, 660-701, Korea, Republic of
Pyung-Gee Kim
Affiliation:
km17a2vod@empal.com, Gyeongsang National University, School of Nano and Advanced Materials Engineering, 900 Gajwa-Dong, Jinju, 660-701, Korea, Republic of
Woo-Il Lee
Affiliation:
wilee@snu.ac.kr, Seoul National University, School of Mechanical and Aerospace Engineering, Seoul, 151-742, Korea, Republic of
Jong-Kyoo Park
Affiliation:
pjkyoo@hananet.net, Agency for Defense Development, 4-R&D Center, Daejeon, 305-600, Korea, Republic of
Lawrence K. DeVries
Affiliation:
kldevries@eng.utah.edu, University of Utah, Department of Mechanical Engineering, Salt Lake City, UT, 84112, United States
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Abstract

Self-sensing and interfacial evaluation were investigated with different dispersion solvents for single carbon fiber/carbon nanotube (CNT)-epoxy composites by electro-micromechanical technique and acoustic emission (AE) under loading/subsequent unloading. Optimized dispersion procedure was set up to obtain improved mechanical and electrical properties. Apparent modulus and electrical contact resistivity for CNT-epoxy composites were correlated with different dispersion solvents for CNT. CNT-epoxy composites using good dispersion solvent showed higher apparent modulus because of better stress transferring effect due to relatively uniform dispersion of CNT in epoxy and enhanced interfacial adhesion between CNT and epoxy matrix. However, good solvent showed high apparent modulus but low thermodynamic work of adhesion, Wa for single carbon microfiber/CNT-epoxy composite. It is because hydrophobic high advanced contact angle was shown in good solvent, which can not be compatible with carbon microfiber well. Damage sensing was also detected simultaneously by AE combined with electrical resistance measurement. Electrical resistivity increased stepwise with progressing fiber fracture due to the maintaining numerous electrical contact by CNT.

Keywords

sensormicroelectro-mechanical (MEMS)electrical properties
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1075: Symposium J – Passive and Electromechanical Materials and Integration , 2008 , 1075-J05-04
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

(1) Iijima, S. Nature 354, 56–58 (1991).Google Scholar
(2). Thostenson, E. T. Ren, Z. Chou, T. W. Composites Science and Technology 61, 1899–1912 (2002).Google Scholar
(3) Lourie, O. Wagner, H. D. Composites Science and Technology 59, 975–977 (1999).Google Scholar
(4) Pipes, R. B. Hubert, P. Composites Science and Technology 62, 419–428 (2002).Google Scholar
(5) Florian, H. , Gojny, Malte, H. G. Wichmann, , Fiedler, Bodo, Bauhofer, Wolfgang, Schulte, Karl, Composites Part A, 36, 1525–1535 (2005).Google Scholar
(6) Choi, Y. K. Sugimoto, K. I. Song, S. M. Gotoh, Y. , Ohkoshi, Endo, M. Carbon, 43, 2199–2208 (2005).Google Scholar
(7) Hammel, E. H. Tang, X. Trampert, M. Schmitt, T. Mauthner, K. Eder, A. Potschke, P., Carbon, 42, 1153–1158 (2004).Google Scholar
(8) Chen, J. Wei, G. Maekawa, Y. Yoshida, M. Tsubokawa, N. Polymer, 44, 3201–3207 (2003).Google Scholar
(9) Karim, A. Slawecki, T. M. Kumar, S. K. Douglas, J. F. Satija, S. K. Han, C. C. Russell, T. P., Liu, Y. Overney, R. Sokolov, J. Rafailovich, M. H. Macromolecules, 31, 857–862 (1998).Google Scholar
(10) Balkenende, A. R. Boogaard, A. P. Scholten, M. Willard, N. P. Langmuir, 14, 5909–5912 (1998).Google Scholar
(11) Jin, L. Qun, F. Chen, W. H. Huang, K. B. Ling, C. Y. Trans Nonferrous Met Soc, 16: 457–461 (2006).Google Scholar
(12) Park, J. M. Lee, S. I. Kim, K. W. Yoon, D. J. J Colloid Interface Science, 237, 80–90 (2001).Google Scholar
(13) Park, J. M. Chong, E. M. Yoon, D. J. Lee, J. H. Polymer Composites, 19, 747–757 (1998).Google Scholar
(14) Ma, B. T. Schadler, L. S. Laird, C. Figueroa, J. C. Polymer Composites, 11, 211–216 (1990).Google Scholar
(15) Park, J. M. Kim, D. S. Kim, S. R. Composites Science Technology, 64: 847–60 (2004).Google Scholar
(16) Owen, D. K. Wendth, R. C. J Apply Polymer Science, 13, 1741–1747 (1969).Google Scholar