Hostname: page-component-848d4c4894-jbqgn Total loading time: 0 Render date: 2024-06-30T21:06:07.281Z Has data issue: false hasContentIssue false
  • English
  • Français

Direct Measurement of Hot-spot Temperature in Flip-chip Solder Joints With Cu Columns Under Current Stressing using Infrared Microscopy

Published online by Cambridge University Press:  01 February 2011

Chih Chen ,
Yu Chun Liang  and
D. J. Yao
Chih Chen
Affiliation:
ted-liang@yahoo.com.tw, National Chiao Tung University, Dept. of Materials Sci. & Eng., Hsin-Chu, Taiwan, Province of China
Yu Chun Liang
Affiliation:
chih@mail.nctu.edu.tw, National Chiao Tung University, Dept. of Materials Sci. & Eng., Hsin-Chu, Taiwan, Province of China
D. J. Yao
Affiliation:
djyao@mx.nthu.edu.tw, National Tsing Hua University, Institute of Microelectromechanical System, Hsinchu, Taiwan, Province of China
Get access

Abstract

In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 104 A/cm2 at 100℃C, the hot-spot temperature is 132.2℃ which surpasses the average Cu column temperature of 129.7℃C and the average solder bump temperature of 127.4 ℃. Thermomigration in solder may still occur under a large current stressing.

Keywords

electromigrationCusoldering
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1249: Symposia E/F – Advanced Interconnects and Chemical Mechanical Planarization for Micro-and Nanoelectronics , 2010 , 1249-F08-02
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Tu, K. N. Tu, “Recent advances on electromigration in very-large large-scale scale-integration of interconnects,” J. Appl. Phys. Phys., Vol. 94, (2003), pp. 5451–5473.Google Scholar
2 International Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, CA (2003)Google Scholar
3 Liu, C. Y. Chen, Chih, Liao, C.N. and Tu, K. N. Tu, “Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes,” Appl. Phys. Lett. Lett., Vol. 75, (1999), pp. 58–60.Google Scholar
4 Yeh, Everett C.C. Choi, W. J. and Tu, K. N. “Electrochromic semiconductor nanocrystal films,” Appl. Phys. Lett. Lett., Vol. 80, (2002), pp. 4–6.Google Scholar
5 Shao, T. L. Chen, Y. H. Chiu, S. H. and Chen, Chih, “Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti/Cr Cr-Cu/Cu and Ni(P)/Au metallization pads pads,” J. Appl. Phys. Phys., Vol. 96, (2004), pp. 4518–4524 Google Scholar
6 Choi, W. J. Yeh, E. C. C. and Tu, K. N. “Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization,” J. Appl. Phys. Vol. 94, (2003), pp. 5665–5671.Google Scholar
7 Ye, Hua, Basaran, Cemal, and Hopkins, Douglas, “Thermomigration in Pb–Sn solder joints under joule heatin heating during electric current stressing,” Appl. phys. Lett. Vol. 82, (2003), pp.1045–1047.Google Scholar
8 Chiu, S. H. Shao, T. L. and Chen, Chih, “Infrared microscopy of hot spots induced by Joule heating in flip flip-chip SnAg solder joints under accelerated electromigration,” Appl. Phys. Lett. Lett., Vol. 88, (2006), pp. 022110–1.Google Scholar
9 Liang, S. W. Chang, Y. W. and Chen, Chih, “Effect of Al-trace dimension on Joule heating and current crowding in flip flip-chip solder joints under accelerated electromigration,” Appl. Phys. Lett. Lett., Vol. 88, (2006), pp. 172108–1.Google Scholar
10 Hsiao, H.Y. and Chen, Chih, “Thermomigration in flip flip-chip SnPb solder joints under alternating current stressing,” Appl. Phys. Lett Lett., Vol. 90 (2007), pp. 152105–1.Google Scholar
11 Liang, S.W. Chang, Y.W. and Chen, Chih, “Relieving Hot-Spot Temperature and Current Crowding Effects During Electromigration in Solder Bumps by Using Cu Columns” Journal of ELECTRONIC MATERIALS, Vol. 36, No. 10, 2007, DOI: 10.1007/s11664 s11664-007 007-0232 0232-3Google Scholar
12 Black, J.R. IEEE Trans. Electron Devices ED-16, 338 (1969).Google Scholar