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Diffusion Barriers for Copper Metallization: Predicting Phase Stability and Reactivity using Equilibrium Thermodynamics

Published online by Cambridge University Press:  10 February 2011

C. E. Ramberg ,
E. Blanquet ,
M. Pons ,
V. Ghetta ,
C. Bernard  and
R. Madar
C. E. Ramberg
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
E. Blanquet
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
M. Pons
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
V. Ghetta
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
C. Bernard
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
R. Madar
Affiliation:
LMGP-ENSPG - BP 46 - 38402 St. Martin d'Hères, (France)
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Abstract

The guidelines for designing a conductive, amorphous material, capable of thermodynamic equilibrium with copper, are defined using readily available thermodynamic information. The tradeoff between desired properties – equilibrium at the interfaces, amorphous microstructure, and electronic conductivity – are described, along with trends in relevant binary systems that result in these properties. These guidelines defined systems for experimental study, for which preliminary results are presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 564: Symposium N – Advanced Interconnects and Contacts , 1999 , 299
Copyright
Copyright © Materials Research Society 1999

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