Hostname: page-component-8448b6f56d-xtgtn Total loading time: 0 Render date: 2024-04-19T14:03:49.390Z Has data issue: false hasContentIssue false
  • English
  • Français

Dielectric characteristics of Poly(chloro-p-Xylene) thin films for high energy density pulsed power capacitors

Published online by Cambridge University Press:  01 February 2011

Pratyush Tewari ,
Eugene Furman  and
Michael T. Lanagan
Pratyush Tewari
Affiliation:
put115@psu.edu, Pennsylvania State University, Engineering Science and Mechanics, Room No 274 Materials Research Lab, Penn state Universuty, State College, PA, 16802, State College, PA, 16802, United States, 814-441-5153
Eugene Furman
Affiliation:
euf1@psu.edu, Pennsylvania State University, Materials Research Laboratory, University park, PA, 16802, United States
Michael T. Lanagan
Affiliation:
mxl46@psu.edu, Pennsylvania State University, Materials Research Laboratory, University park, PA, 16802, United States
Get access

Abstract

Poly(chloro-p- Xylene) or Parylene –C thin films are particularly attractive for dielectric as well as biomedical applications. In the current work the dielectric properties of Parylene-C thin films are investigated to form laminar composites with oxide thin films for high energy density pulsed power capacitors. Parylene-C thin films were synthesized by pyrolytic vapor decomposition polymerization of dichloro-di(p-Xylene) monomer. Annealing of films at 225°C has shown to enhance crystallinity of film. Conduction in Parylene-C thin films appears to be bulk-controlled with the hopping charges contributing to leakage current. The barrier height of 0.89eV and hopping distance of 2 - 2.5nm are physically plausible and similar to previously reported values in polymer literature.

Keywords

dielectric propertiescompositepolymer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 949: Symposium C – Smart Dielectric Polymer Properties, Characterization and Their Devices , 2006 , 0949-C04-11
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Cao, Y., Irwin, P.C.and Younsi, K., IEEE Transactions on Dielectrics and Electrical Insulation 11 (5), 797–807 (2004).Google Scholar
2. Tressler, J.F., Alkoy, S., Dogan, A. and Newnham, R.E., Composites - Part A: Applied Science and Manufacturing 30 [4], 477–482 (1999).Google Scholar
3. Sharma, Ashok K. and Nicholas, Michael F., Journal of Applied Polymer Science 36, 1555–1565 (1988).Google Scholar
4. Mey, Gilbert De, Journal of Non-Crystalline Solids 23, 315–320 (1977)Google Scholar
5. Lee, Jeon Hoon, Hwang, Kyo Seon, Yoon, Ki Hyun, and Ahn, Saeyoung, IEEE transactions on plasma science 32 [2], 505–509 (2004).Google Scholar
6. Jonscher, A.K., Dielectric relaxation in solids, Chelsea Dielectrics Press, London UK, 1983.Google Scholar
7. Dietz, G.W., Schumacher, M., Waser, R., Streiffer, S.K., Basceri, C. and Kingon, A.I., Journal of Applied Physics 82 [5], 2359–2364 (1997)Google Scholar
8. Rose, A., Physical Review 97 [6], 1539–1544 (1955).Google Scholar
9. Ieda, M., IEEE transactions on electrical insulations 19, 162–168 (1984).Google Scholar
10. Tung, R.T., Sullivan, J.P. and Schrey, F., Materials Science and Engineering, B14 [3], 266–280 (1992).Google Scholar
11. Bugelman, Marc, Thin Solid Films 70, 1–5 (1980).Google Scholar
12. Grado-Caffaro, M.Aand Grado-Caffaro, M, Optik 116 [6], 299–300 (2005).Google Scholar