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Determination of the Planarization Distance for Copper CMP Process

Published online by Cambridge University Press:  10 February 2011

S Hymes ,
K. Smekalin ,
T. Brown ,
H. Yeung ,
M. Joffe ,
M. Banet ,
T Park ,
T. Tugbawa ,
D. Boning  and
J. Nguyen
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S Hymes
Affiliation:
SEMATECH, 2706 Montopolis Drive, Austin, Texas, 78741–6499;
K. Smekalin
Affiliation:
SEMATECH, 2706 Montopolis Drive, Austin, Texas, 78741–6499; National Semiconductor Corp., 2900 Semiconductor Drive, M/S E-100, Santa Clara, CA 95051;
T. Brown
Affiliation:
SEMATECH, 2706 Montopolis Drive, Austin, Texas, 78741–6499;
H. Yeung
Affiliation:
Philips Analytical Systems, 12 Michigan Drive, Natick, MA 01760;
M. Joffe
Affiliation:
Philips Analytical Systems, 12 Michigan Drive, Natick, MA 01760;
M. Banet
Affiliation:
Philips Analytical Systems, 12 Michigan Drive, Natick, MA 01760;
T Park
Affiliation:
Microsystems Technology Laboratories, EECS Department, MIT, 60 Vassar Street, Room 39–567B, Cambridge, MA 02139;
T. Tugbawa
Affiliation:
Microsystems Technology Laboratories, EECS Department, MIT, 60 Vassar Street, Room 39–567B, Cambridge, MA 02139;
D. Boning
Affiliation:
Microsystems Technology Laboratories, EECS Department, MIT, 60 Vassar Street, Room 39–567B, Cambridge, MA 02139;
J. Nguyen
Affiliation:
IPEC Corporation, 4717 East Hilton Ave, Phoenix AZ, 85034;
T. West
Affiliation:
T. West, W. Sands, Thomas West Inc.470 Mercury Drive, Sunnyvale, CA, 94086.
W. Sands
Affiliation:
T. West, W. Sands, Thomas West Inc.470 Mercury Drive, Sunnyvale, CA, 94086.
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Abstract

A planarization monitor has been applied to the copper system to investigate pattern dependencies during copper overburden planarization. Conventional profilometry and a noncontact, acousto-optic measurement tool, the Insite 300, are utilized to quantify the planarization performance in terms of the defined step-height-reduction-ratio (SHRR). Illustrative results as a function of slurry, pad type and process conditions are presented. For a typical stiff-pad copper CMP process, we determined the planarization distance to be approximately 2mm.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 211
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Nakagawa, O.S., Rahmat, K., Chang, N., Oh, S.Y., Nikkel, P. and Crook, D., Proc. CMPMIC, p. 251–7. (1997).Google Scholar
2. Ouma, D., Boning, D., Chung, J., Shinn, G., Olsen, L., Clark, J., Proc. IEEE IITC, p. 67–9, (1998).Google Scholar
3. Smith, T.H., Fang, S.J., Boning, D.S., Shinn, G.B. and Stefani, J.A., Proc. CMPMIC, p. 97–104. (1999).Google Scholar
4. Grillaert, J., M Meuris, Heyley, H., Devriendt, K., Vrancken, E. and Heyns, M., Proc. CMPMIC, p.79–86, (1998).Google Scholar
5. Joffe, M.A., Yeung, H., Fuchs, M. and Banet, M. and Hymes, S., Proc. CMPMIC, p. 73–6, (1999).Google Scholar