Hostname: page-component-788cddb947-2s2w2 Total loading time: 0 Render date: 2024-10-20T15:20:26.635Z Has data issue: false hasContentIssue false
  • English
  • Français

Determination of the Mechanical Properties OP Integrated Circuit Packaging Materials using a Focused Acoustic Beam Technique

Published online by Cambridge University Press:  22 February 2011

De Zhang  and
Gabriel M. Crean
De Zhang
Affiliation:
National Microelectronics Research Centre, Prospect Row, Cork, Ireland
Gabriel M. Crean
Affiliation:
National Microelectronics Research Centre, Prospect Row, Cork, Ireland
Get access

Abstract

A novel method for the measurement of the mechanical properties of integrated circuit interconnection and packaging materials using a conventional acoustic microscope lens, is presented in this paper. This technique allows the simultaneous generation and detection of longitudinal (LW) and shear (SH) acoustic waves in a material system based upon acoustic mode conversion principles at a water-solid interface. Experimental results obtained using a 50 MHz acoustic lens are presented for a range of ceramic materials and compared with published data. Acoustic ray propagation theory is employed to analyse the experimental results.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 281
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Groothuis, Steven, et al. “Computer Aid Stress Modeling for Optimizing Plastic Package Reliability” 23rd Annual Proc. Reliability Physics, pp184–191, 1985 CrossRefGoogle Scholar
[2] Wilson, E.A., “two Finite Element Models for Integrated Circuit Packaging Thermal Simulation” Proc. Summer Computer Simulation Conf. 214 (1980)Google Scholar
[3] Segmuleller, A. and Murakami, M., “X-Ray Diffraction Analysis of Strains and Stress in Thin Films”, in Treatise on Materials Science and Engineering, Vol. 27, Herman, H., ed. Academic Press, New York, 1988, pp143–200 Google Scholar
[4] Flim, Paul A. “Principles and Application of Wafer Curvature Techniques for Stress Measurements in Thin Films” MRS Symposium Proceeding Vol. 130 pp41–51 1990 Google Scholar
[5] Crean, G.M. et al. “Correlation Between the Elastic and Structural Properties of Thin-Film Tungsten Suicide Layers from Surface Acoustic Wave Analysis” Applied Physics Letter Vol. 51, No. 20 pp1591–1593 1987 CrossRefGoogle Scholar
[6] Pethica, J.B. and Oliver, W.C. “Mechanical Properties of Nanometer Volumes of Material: use of the Elastic Response of Small Area Indentations” MRS Symposium Proceeding Vol. 130, p 13–17 1990 CrossRefGoogle Scholar
[7] Brekhovskikh, L.M. “Wave in Layered Media” 2nd ed. Academic Press, NewYork CrossRefGoogle Scholar
[8] Mason, W.P. “Acoustic Properties of Solid” in “American Institute of physics handbook” 3rd ed., McGraw Hill Book Company, 1972 Google Scholar
[9] Consolidated Beryllium Ltd., “property Data”, 1988 Google Scholar
[10] Harker, A.H. “Elastic Wave in Solids” p. 31 1988 British Gas pic, Eyre & Spottiswoode Ltd., Grosvenor Press, Portsmouth Google Scholar