Hostname: page-component-8448b6f56d-tj2md Total loading time: 0 Render date: 2024-04-24T10:31:57.968Z Has data issue: false hasContentIssue false

Deep Centers and Their Capture Barriers in MOCVD-Grown GaN

Published online by Cambridge University Press:  21 March 2011

Daniel K. Johnstonea
Affiliation:
Air Force Office of Scientific Research, Arlington, VA 22203, USA
Mohamed Ahoujjab
Affiliation:
University of Dayton, Dayton, OH 45469, USA
Yung Kee Yeoc
Affiliation:
Air Force Institute of Technology, Wright-Patterson AFB, OH 45433, USA
Robert L. Hengeholdc
Affiliation:
Air Force Institute of Technology, Wright-Patterson AFB, OH 45433, USA
Louis Guidod
Affiliation:
Virginia Polytechnic Institute and State University, Blacksburg, VA 24061, USA
Get access

Abstract

GaN and its related alloys are being widely developed for blue-ultraviolet emitting and detection devices as well as high temperature, high power, and high frequency electronics. Despite the fast improvement in the growth of good quality GaN, a high concentration of deep level defects of yet unconfirmed origins are still found in GaN. For both optical and electronic devices, these deep carrier traps and/or recombination centers are very important and must therefore be understood. In the present work, deep level defects in GaN grown on sapphire substrates by metal organic chemical vapor deposition (MOCVD) have been investigated using Isothermal Capacitance Transient Spectroscopy (ICTS) and Current Voltage Temperature (IVT) measurements. Several deep level electron traps were characterized, obtaining the emission energy, concentration, and capture cross section from a fit of exponentials to the capacitance transients. ICTS was also used to reveal information about the capture kinetics involved in the traps found in GaN by measuring the amplitude of the capacitance transient at each temperature. At a reduced filling pulse where the traps were not saturated, several of them showed marked reduction in capacitance transient amplitude when compared to the transient amplitude measured under conditions where the filling pulse saturates the traps. This reduction in transient amplitude indicates that there is a barrier to carrier capture, in addition to the emission barrier. It has been found that several traps had capture barriers that were significant fractions of the emission energies up to 0.32 eV. These capture barriers may lead to persistent photoconductivity and reduced trapping. In this paper, deep level emission energies as well as capture barrier energies found in MOCVD-grown GAN will be discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Hayami, A., Mochizuki, M., Tonami, J., Nakamura, H., and Itonaga, M., ‘High density optical disk system using D8–15 modulation code and new signal-processing techniques,’ IEEE Transactions on Consumer Electronics 46, pp. 555561, 2000.Google Scholar
2. Zhang, L., Lester, L., Baca, A., Shul, R., Chang, P., Willison, C., Mishra, U., Denbaars, S., Zolper, J., ‘Epitaxially-grown GaN junction field effect transistors,’ IEEE Transactions on Electron Devices 47, pp. 507511, 2000.Google Scholar
3. Kunihiro, K., Kasahara, K., Takahashi, Y., Ohno, Y., ‘Microwave performance of 0.3-μm gatelength multi-finger AlGaN/GaN heterojunction FETs with minimized current collapse,’ Jpn. J. Appl. Phys. Suppl. 39, pp. 24312434, 2000.Google Scholar
4. Binari, S., Kruppa, W., Dietrich, H., Kelner, G., Wickenden, A., Freitas, J., ‘Fabrication and characterization of GaN FETs,’ Solid-State Electron. 41, pp. 15491554, 1997.Google Scholar
5. Saxler, A., ‘A review of the electrical properties of AlXGa1-xN materials for UV photodetector applications,’ Proceedings of the SPIE 3948, pp. 330341, 2000.Google Scholar
6. Sandvik, P., Walker, D., Kung, P., Mi, K., Shahedipour, F., Kumar, v., Zhang, X., Diaz, J., Jelen, C., Razeghi, M., ‘Solar-blind AlxGa1-xN p-i-n photodetectors grown on LEO and non-LEO GaN,’ Proceedings of the SPIE 3948, pp. 265272, 2000.Google Scholar
7. Pernot, C., Hirano, A., Iwaya, M., Detchprohm, T., Amano, H., Akasaki, I., ‘Solar-blind UV photodetectors based on GaN/AlGaN p-i-n photodiodes,’ Jpn. J. Appl. Phys., Pt.2 39, pp. L387389, 2000.Google Scholar
8. Kim, K., Oh, C., Lee, W., Lee, K., Yang, G., Hong, C., Suh, E., Lim, K., Lee, H., Byun, D., ‘Comparative analysis of characteristics of Si, Mg, and undoped GaN,’ Journal of Crystal Growth 210, pp. 505510, 2000.Google Scholar
9. Zeitouny, A., Eizenberg, M., Pearton, S., Ren, F., ‘W and W/WSi/In1-xAlxN ohmic contacts to n-type GaN,’ Materials Science and Engineering B59, pp. 358361, 1999.Google Scholar
10. Rennie, J., Onomura, M., Nunoue, S., Hatakoshi, G., Sugawara, H., Ishikawa, M., ‘Effect of metal type on the contacts to n-type and p-type GaN,’ Journal of Crystal Growth 189/190, pp. 711715, 1998.Google Scholar
11. Koyama, Y., Hashizume, T., Hasegawa, H., ‘Formation processes and properties of Schottky and ohmic contacts on n-type GaN for field effect transistor applications,’ Solid-State Electronics 43, pp. 14831488, 1999.Google Scholar
12. Johnson, M., Fujita, S., Rowland, W., Bowers, K., Hughes, W., He, Y., Masry, N. El, Cook, J., Schetzina, J., Ren, J., Edmond, J., ‘MBE growth and properties of GaN on GaN/SiC substrates,’ Solid-State Electronics 41, pp. 213218, 1997.Google Scholar
13. Chaudhuri, J., Ng, M., Koleske, D., Wickenden, A., Henry, R., ‘High resolution X-ray diffraction and X-ray topography study of GaN on sapphire,’ Materials Science and Engineering B64, pp. 99106, 1999.Google Scholar
14. Topf, M., Cavas, F., Meyer, B., Kempf, B., Krtschil, A., Witte, H., Veit, P., Christen, J., ‘GaN/SiC heterojunctions grown by LP-CVD,’ Solid-State Electronics 44, pp. 271275, 2000.Google Scholar
15. Razeghi, M., Kung, P., Sandvik, P., Mi, K., Zhang, X., Dravid, V., Freitas, J., Saxler, A., ‘LEO of III-nitride on Al2O3 and Si substrates,’ Proceedings of the SPIE 3948, pp. 320329, 2000.Google Scholar
16. Song, Y., Choi, S., Choi, J., Yang, J., Yang, G., ‘Lateral epitaxial overgrowth of GaN and its crystallographic tilt depending on the growth condition,’ Phys. Status Solidi A 180, pp. 247250, 2000.Google Scholar
17. Davis, R., Nam, O., Zheleva, T., Gehrke, T., Linthicum, K., Rajogopal, P., ‘Lateral- and pendeo-epitaxial growth and defect reduction in GaN thin films,’ Mater. Sci. Forum 338–342, pp. 14711476, 2000.Google Scholar
18. Zheleva, T., Smith, S.. Thomson, D., Linthicum, K., Rajogopal, P., Davis, R., ‘Pendeoepitaxy: a new approach for lateral growth of gallium nitride films,’ J. Electron. Mater. 28, pp. L58, 1999.Google Scholar
19. Koh, E., Park, Y. Ju, Kim, E. Kyu, Park, C., Lee, S. Hun, Lee, J. Hee, Choh, S. Ho, ‘The effect of N+-implanted Si(111) substrate and buffer layer on GaN films,’ J. Cryst. Growth 218, pp. 214220, 2000.Google Scholar
20. Zamir, S., Meyler, B., Zolotoyabko, E., Salzman, J., ‘The effect of AlN buffer layer on GaN grown on (111)-oriented Si substrates by MOCVD,’ J. Cryst. Growth 218, pp. 181190, 2000.Google Scholar
21. Klein, P., Freitas, J., Binari, S., ‘Photoionization spectra of traps responsible for current collapse in GaN MESFETs,’ Wide-Bandgap Semiconductors for High-Power, High-Frequency and High-Temperature Applications, pp. 547552, 1999.Google Scholar
22. Klein, P., Freitas, J., Binari, S., Wickenden, A., ‘Observation of deep traps responsible for current collapse in GaN metal-semiconductor field-effect transistors,’ Appl. Phys. Lett. 75, pp. 40164018, 1999.Google Scholar
23. Hasnain, G., Takeuchi, T., Schneider, R., Song, S., Twist, R., Blomqvist, M., Kocot, C., and Flory, C., ‘On-wafer continuous-wave operation of InGaN/GaN violet laser diodes,’ Electronic Letters 36, pp. 17791780, 2000.Google Scholar
24. Kirchner, P., Schaff, W., Maracas, G., Eastman, L., Chappell, T., Ransom, C., ‘The analysis of exponential and nonexponential transients in deep-level transient spectroscopy,’ J. Appl. Phys. 52, pp. 64626470, 1981.Google Scholar
25. Doolittle, W., Rohatgi, A., ‘A new figure of merit and methodology for quantitatively determining defect resolution capabilities in deep level transient spectroscopy analysis,’ J. Appl. Phys. 75, pp. 45704575, 1994.Google Scholar
26. Lang, D., ‘Deep-level transient spectroscopy: a new method to characterize traps in semiconductors,’ J. Appl. Phys. 45, pp. 30233032, 1974.Google Scholar
27. Lax, M., ‘Cascade capture of electrons in solids,’ Phys. Rev. 119, pp. 15021523, 1960.Google Scholar
28. Henry, C., Lang, D., ‘Nonradiative capture and recombination by multiphonon emission in GaAs and GaP,’ Phys. Rev. B, Solid State 15, pp. 9891016, 1977.Google Scholar
29. Criado, J., Gomez, A., Calleja, E., and Munoz, E., ‘Novel method to determine capture crosssection activation energies by deep-level transient spectroscopy techniques,’ Appl. Phys. Lett. 52, pp. 660661, 1987.Google Scholar
30. Palma, A., Jimenez-Tejada, J., Banqueri, J., Cartujo, P., and Carceller, J., ‘Accurate determination of majority thermal-capture cross sections of deep impurities in p-n junctions,’ J. Appl. Phys. 74, pp. 26052612, 1993.Google Scholar
31. Fang, Z.-Q., Look, D., Kim, W., Fan, Z., Botchkarev, A., and Morkoc, H., ‘Deep centers in n-GaN grown by reactive molecular beam epitaxy,’ Applied Physics Letters 72, pp. 22772279, 1998.Google Scholar
32. Auret, F., Goodman, S., Myburg, G., Koschnick, F., Spaeth, J., Beaumont, B., and Gilbart, P., ‘Defect introduction in epitaxially grown n-GaN during electron beam deposition of Ru schottky contacts,’ Physica B 273–274, pp. 8487, 1999.Google Scholar
33. Wang, C., Yu, L., Lau, S., Yu, E., Kim, W., Botchkarev, A., Morkoc, H., ‘Deep level defects in n-type GaN grown by molecular beam epitaxy,’ Applied Physics Letters 72, pp. 12111213, 1998.Google Scholar
34. Hacke, P., Okushi, H., Kuroda, T., Detchprohm, T., Hiramatsu, K., Sawaki, N., ‘Characterization of mid-gap states in HVPE and MOVPE-grown n-type GaN,’ Journal of Crystal Growth 189/190, pp. 541545, 1998.Google Scholar
35. Polyakov, A., Smirnov, N., Govorkov, A., Mil'vidskii, M., Usikov, A., Pushnyi, B., and Lundin, W., ‘Deep centers in AlGaN-based light emitting diode structures,’ Solid State Electronics 43, pp. 19291936, 1999.Google Scholar
36. Cho, H., Hong, C., Kim, K., Suh, E., and Lee, H., ‘Deep levels in GaN grown by metalorganic chemical vapor depositions,’ Ungyong Mulli 12, pp. 456461, 1999.Google Scholar
37. Hullavarad, S., Bhoraskar, S., Sainkar, S., Badrinarayanan, S., Mandale, A., Ganesan, V., ‘Deep levels in GaN grown by nitridation of GaAs (110) surface in a electron cyclotron resonance ammonia plasma,’ Vacuum 55, pp. 121126, 1999.Google Scholar
38. Kang, T., Yuldashev, S., Park, C., Chi, C., Park, S., Ryu, Y., and Kim, T., ‘Deep levels in GaN epilayers grown on sapphire substrates,’ Solid State Communications 112, pp. 637642, 1999.Google Scholar
39. Polyakov, A., Smirnov, N., Govorkov, A., Shin, M., Skowronski, M., Greve, D., ‘Deep centers and their spatial distribution in undoped GaN films grown by organometallic vapor phase epitaxy,’ Journal of Applied Physics 84, pp. 870876, 1998.Google Scholar
40. Morkoc, H., Cingolani, R., Gil, B., ‘Polarization effects in nitride semiconductor device structures and performance of modulation doped field effect transistors,’ Solid-State Electronics 43, pp. 17531771, 1999.Google Scholar
41. Jiang, H. and Singh, J., ‘Gain characteristics of InGaN-GaN quantum wells,’ IEEE Journal of Quantum Electronics 36, pp. 10581064, 2000.Google Scholar