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Damage Evolution and Mechanical Failure in Flip-chip Interconnects

Published online by Cambridge University Press:  10 February 2011

A. Soperm ,
I. De Wolf ,
G. Pozza ,
M. Ignat  and
G. Parat
A. Soperm
Affiliation:
LTPCM, CNRS-INPG/UJF BP. 75, 38402 Saint Martin d'Hères - France
I. De Wolf
Affiliation:
IMEC Kapeldreef 75 B 3001 Leuven - Belgium
G. Pozza
Affiliation:
LTPCM, CNRS-INPG/UJF BP. 75, 38402 Saint Martin d'Hères - France
M. Ignat
Affiliation:
LTPCM, CNRS-INPG/UJF BP. 75, 38402 Saint Martin d'Hères - France
G. Parat
Affiliation:
LETI-CEA, 17 Av. des Martyrs, 38054 Grenoble - France
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Abstract

The analysis of the mechanical behaviour of flip-chip interconections is an essential aspect of the reliability of the devices using this technique. When manufacturing them and during their operation, the interconective systems are submitted to thermal and mechanically induced stresses. By cyclic micromechanical testing and from analysis by micro Raman of singularities, we studied the mechanical response and the failure of samples, consisting of a substrate, the interconections and a chip.

Two sort of low melting point alloys were investigated, with different metallurgies for the pads, holding the interconections.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 105
Copyright
Copyright © Materials Research Society 1998

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References

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