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Crystal Structure and Thermoelectric Properties of Al-containing Re Silicides

Published online by Cambridge University Press:  26 February 2011

Eiji Terada ,
Min-Wook Oh ,
Dang-Moon Wee  and
Haruyuki Inui
Eiji Terada
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606–8501, Japan
Min-Wook Oh
Affiliation:
Department of Materials Science and Engineering, KAIST, Yuseong-gu, Daejon 305–701, Republic of Korea
Dang-Moon Wee
Affiliation:
Department of Materials Science and Engineering, KAIST, Yuseong-gu, Daejon 305–701, Republic of Korea
Haruyuki Inui
Affiliation:
Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, Kyoto 606–8501, Japan
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Abstract

The microstructure, defect structure and thermoelectric properties of Al-containing ReSi1.75 based silicides have been investigated. All the Al-containing alloys investigated contain four differently oriented domains accompanied by the twinned microstructure, as the binary alloy does. However, thin defect layers containing a kind of shear structure are locally and sporadically formed at some of twin boundaries. In the defect layer, shear occurs by the vector of [100] on either (1 09) or (107) planes. Binary ReSi1.75 exhibits nice thermoelectric properties as exemplified by the high value of dimensionless figure of merit (ZT) of 0.70 at 800 °C when measured along [001], although the ZT value along [100] is just moderately high. Al-containing Re silicides considerably increase the ZT value along [100] so that the maximum value of 0.95 is achieved at 150 °C for the ReSi1.75Al0.02 alloy. The temperature dependence of electrical resistivity changes from of semiconductor for the binary alloy to of metal for the Al-added alloys and the value of electrical resistivity is significantly reduced when compared to the binary counterpart.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 842: Symposium S – Integrative and Interdisciplinary Aspects of Intermetallics , 2004 , S5.7
Copyright
Copyright © Materials Research Society 2005

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References

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