Hostname: page-component-848d4c4894-tn8tq Total loading time: 0 Render date: 2024-06-17T01:08:09.003Z Has data issue: false hasContentIssue false

Cosio2 Formation on Strained GexSi1−x Layers BY Co/GexSi1−x Thermal Reaction

Published online by Cambridge University Press:  21 February 2011

M.M. Ridgway
Affiliation:
Department of Electronic Materials Engineering, Research School of Physical Sciences and Engineering, Australian National University, Canberra, Australia
R.R. Elliman
Affiliation:
Department of Electronic Materials Engineering, Research School of Physical Sciences and Engineering, Australian National University, Canberra, Australia
R. Pascual
Affiliation:
Departaent of Materials and Metallurgical Engineering, Queen's University, Kingston, Canada
J.J. Whitton
Affiliation:
Department of Physics, Queen's University, Kingston, Canada
J.-M. Baribeau
Affiliation:
Institute for Microstructural Sciences, National Research Council of Canada, Ottawa, Canada
Get access

Abstract

The formation of CoSi2 on Ge.17Si.83 layers by Co/Ge.17Si.83 thermal reaction nas been studied with a variety of analytical techniques. Co films deposited on strained Ge.17Si.83 layers were annealed at 600°C for 0–240 min. Following 240 rain annealing, the reacted surface layer was composed of CoSi, CoSi2 and GexSi1-x precipitates (the latter probably rich in Ge) as identified with transmission electron microscopy, x-ray diffraction and/or Raman spectroscopy. Lateral phase non-uniformity was evident with both transmission and scanning electron microscopy. For samples annealed with and without an evaporated Co film, enhanced relaxation of the underlying Ge.17Si.83 layer was apparent in the former.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Ridgway, M.C., Elliman, R.G., Hauser, N., Baribeau, J.-M. and Jackman, T.E., in Advanced Metallization and Processing for Semiconductor Devices and Circuits - II, eds.Katz, A., Murarka, S.P., Nissim, Y.I. and Harper, J.M.E. (Hat.Res. Soc., Pittsburgh, 1992) p. 857.Google Scholar
[2] Ridgway, M.C., Elliman, R.G., Moss, S., Patterson, P.J.K. and Baribeau, J.-M., J.Appl.Phys., submitted 1993.Google Scholar
[3] Baribeau, J.-M., Jackman, T.E., Houghton, D.C., Maigne, P. and Denhoff, M.W., J.Appl.Phys. 13, 5738 (1988).CrossRefGoogle Scholar
[4] Reuter, W., in Proceedings of the Sixth International Conference on X-Ray ODtics and Microanalysis, eds. Shinioda, G. et al. (University of Tokyo Press, Tokyo, 1972).Google Scholar
[5] Wald, F. and Michalik, S.J., J.Less-Common Met. 24, 277 (1971).CrossRefGoogle Scholar
[6] Prokes, S.M., Glembocki, O.J., Twigg, N.E. and Wang, K.L., J.Elec.Mat. 20, 389 (1991).CrossRefGoogle Scholar
[7] Higgs, V., Kightley, P., Goodhew, J. and Augustus, P.D., Appl.Phys.Lett. 592, 829 (1991).CrossRefGoogle Scholar
[8] Buxbaum, A., Zolotoyabko, E., Eizenberg, M. and Schaffler, F., Thin Solid Films 222, 157 (1992).CrossRefGoogle Scholar
[9] Ridgway, M.C., Elliman, R.G. and Baribeau, J.-M., to be published.Google Scholar
[10] Alonso, M.I. and Winer, K., Phys.Rev. B39 10056 (1989).CrossRefGoogle Scholar
[11] Shergill, G.S., Wei, C.-S., Cox, J.N., Fraser, D.B. and Murray, J.J., Int.Anal. (1988).Google Scholar
[12] Weaver, L., Simard-Normandin, M., Naem, A. and Clark, A.J., in Advanced Metallization and Processing for Semiconductor Devices and Circuits - II, eds.Katz, A., Murarka, S.P., Nissim, Y.I. and Harper, J.M.E. (Mat.Res.Soc., Pittsburgh, 1992).Google Scholar