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Controlling the Microstructure of the 2223 Phase Grains for the Fabrication of Silver Clad (Bi,Pb)2Sr2Ca2Cu3Ox Tapes Through the Growth Kinetics of the Superconducting Phases

Published online by Cambridge University Press:  26 February 2011

Wai Lo
Affiliation:
IRC in Superconductivity, University of Cambridge, Madingley Road, Cambridge CB3 OHE, UK.
B. A. Glowacki
Affiliation:
IRC in Superconductivity, University of Cambridge, Madingley Road, Cambridge CB3 OHE, UK.
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Abstract

Our study concentrated on the relationship between the proportions of the phases in the precursors used to synthesise the Bi-2223 phase and the ultimate microstructures of the 2223 phase materials, although the overall cation stoichiometry fixed. It was found that the final 2223 phase grains were larger, although the bulk density tended to be lower with the grains loosely packed together, when the major phase in the precursor was 2212 phase. This was proved to be partly caused by the fast growth rate of the 2212 phase grains which were eventually converted into the 2223 phase. When 2223 phase was present in the precursor, the bulk density became higher and 2223 phase grains became closely packed together, although the average grain size became smaller. This was explained by the existence of a liquid phase at higher temperatures during the formation of the 2223 phase and the sintering of the 2223 phase grains.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCE

1. Jain, K., Suri, D. K., Nagpel, K. C., Rao, S. U. M. and Das, B. K., Jap. J. Appl. Phys. 29 L576 (1990).Google Scholar
2. Kikuchi, A., Matsuda, M., Takata, M., Ishii, M., Yamashita, T. and Koinuma, H., Jap. J. Appl. Phys. 22 L2300 (1988).Google Scholar
3. Dou, S. X., Liu, H. K., Wang, J. and Blan, W. M., Supercond. Sci. Technol. 4 21 (1991).Google Scholar
4. Enami, H., Kawahara, N., Shinohara, T., Kawabata, S., Hoshizaki, H., Matsumuro, A. and Imura, T. Jap. J. Appl. Phys. 28 L377 (1989).Google Scholar
5. Narumi, S. I., Ohtsu, H., Iguchi, I. and Yoshizaki, R., Jap. J. Appl. Phys. 21 L27 (1989).Google Scholar
6. Lo, Wai and Glowacki, B.A. in High Temperture Superconductors. Materials Aspects, edited by Freyhardt, H. C., Flukiger, R. and Peuckert, M. (Proceedings of the ICMC'90 Topic Cofference on Materials Aspects of High-Temperature Superconductors 2 CGM Informationsgesellschaft mbH, 1991) pp. 1005–10.Google Scholar
7. Lo, Wai and Glowacki, B.A., to be presented on ICMC/ICEC, Kiev, 8–12 June, 1992.Google Scholar
8. Jain, K., Suri, D. K., Nagpal, K. C., Rao, S. U. M., Das, B. K., Mat. Res. Bull., 25, 1057 (1990).Google Scholar
9. Dou, S. X., Liu, H. K., Apperley, M. H., Song, K. H., Sorrell, C. C., Easterling, K. E., Niska, J. and Guo, S.J., Physica C 167 525 (1990).Google Scholar
10. Takahashi, Y. and Suga, T., Jap. J. Appl. Phys. 29 L2006 (1990).Google Scholar
11. Lo, Wai, Chen, Y. L., Tang, Tong B. and Stevens, R., Br. Ceram. Trans. J. 89 218 (1990).Google Scholar
12. Chen, Y. L., Stevens, R., Lo, Wai and Zhen, Y. S., J. Mat. Sci.: Mat. Electron. 1185 (1990).Google Scholar
13. Yamada, Y., Obst, B. and Flukiger, R., Supercond. Sci. Technol. 4 165 (1991).Google Scholar
14. Lam, Q. U., Kim, Y. and Jeffries, C. D., Phys. Rev. B42 4648 (1990).Google Scholar
15. Muller, K. H., Physica C 159 717 (1990).Google Scholar
16. Chen, D. X., Sanchez, A., Puig, T., Martinez, L. M. and Munoz, J. S., Physica C 168 652 (1990).Google Scholar