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Chemical Vapor Deposition Coating for Micromachines

Published online by Cambridge University Press:  10 February 2011

S. S. Mani
Affiliation:
MS 1084, PO Box 5800, Sandia National Laboratories, Albuquerque, NM 87185-1084, ssmani@sandia.gov
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Abstract

Two major problems associated with Si-based MEMS devices are stiction and wear. Surface modifications are needed to reduce both adhesion and friction in micromechanical structures to solve these problems. In this paper, we will present a process used to selectively coat MEMS devices with tungsten using a CVD (Chemical Vapor Deposition) process. The selective W deposition process results in a very conformal coating and can potentially solve both stiction and wear problems confronting MEMS processing. The selective deposition of tungsten is accomplished through silicon reduction of WF6, which results in a self-limiting reaction. The selective deposition of W only on polysilicon surfaces prevents electrical shorts. Further, the self-limiting nature of this selective W deposition process ensures the consistency necessary for process control. Selective tungsten is deposited after the removal of the sacrificial oxides to minimize process integration problems. This tungsten coating adheres well and is hard and conducting, requirements for device performance. Furthermore, since the deposited tungsten infiltrates under adhered silicon parts and the volume of W deposited is less than the amount of Si consumed, it appears to be possible to release stuck parts that are contacted over small areas such as dimples. Results from tungsten deposition on MEMS structures with dimples will be presented. The effect of wet and vapor phase cleans prior to the deposition will be discussed along with other process details. The W coating improved wear by orders of magnitude compared to uncoated parts. Tungsten CVD is used in the integrated-circuit industry, which makes this approach manufacturable.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

1 Howe, R. T., Muller, R. S., “Polycrystalline Silicon Micromechanical Beams”, J. Electrochem Soc: Solid State Science & Technology, vol. 103, No. 6, pp. 14201423, 1983.10.1149/1.2119965Google Scholar
2 Garcia, E. J. and Sniegowski, J. J., “Surface Micromachined Microengine”, Sensors and Actuators A, vol. 48, p. 203214, 1995.10.1016/0924-4247(95)00999-XGoogle Scholar
3 Deng, K., Collins, R. J., Mehrengany, M., and Sukenik, C. N., “performance impact of monolayer coating of polysilicon micromotors”, J. Electro Chem Soc, vol 142, no 4, p. 12781285, 1995.10.1149/1.2044164Google Scholar
4 Alley, R. L., Cuan, G. J., Howe, R. T. and Komvopoulos, K., “The effect of release-etch processing on surface microstructure stiction”, Proceedings IEEE Solid State Sensor and Actuator Workshop, Hilton Head Is, SC, pp. 202207, 1992.Google Scholar
5 Legtenberg, R., Tilmans, H. A. C., Elders, J., Elwenspoek, M., “Stiction of surface micromachined structures after rinsing and drying:model and investigation of adhesion mechanism”, Sensors and Actuators A, vol. 43, pp. 230238, 1994.10.1016/0924-4247(93)00654-MGoogle Scholar
6 Maboudian, R., “Adhesion and friction issues associated with reliable operation of MEMS”, MRS Bulletin, June, pp. 4751, 1998.10.1557/S0883769400030633Google Scholar
7 Maboudian, R., “Surface processes in MEMS technology”, Surface Science Reports, 30, p. 207269, 1998.10.1016/S0167-5729(97)00014-9Google Scholar
8 Mulhern, G. T., Soane, D. S. and Howe, R. T., “Supercritical carbon dioxide drying of microstructures”, Proceedings International Conference on Solid-State Sensors and Actuators (Transducers '93), Yokohama, Japan, pp. 296299, 1993.Google Scholar
9 Henck, S. A., “Lubrication of digital micromirror devicesTM ”, Tribology Letters 3, p. 239247, 1997.10.1023/A:1019129021492Google Scholar
10 Man, P. F., Gogoi, B. P., and Mastraugelo, C. H., “Elimination of post release adhesion in microstructures using thin conformal fluorocarbon films”, Proceedings, Micro Electro Mechanical Systems '96, San Diego, CA USA p. 5560.Google Scholar
11 Bradbury, D. R., Turner, J. E., K. Nauka and Chiu, K. Y., “Selective CVD tungsten as an alternative to blanket tungsten for submicron plug applications on VLSI circuits”, IEDM, p. 273276, 1991.Google Scholar
12 Sekine, M., Kakuhara, Y., Yamazaki, K. and Murao, Y., “Si reduction reaction mechanism of selective W-CVD”, MRS, Advanced Metallization ULSI Applications, p. 255, 1991.Google Scholar
13 Yu, M. L., Eldridge, B. N., and Joshi, R. V., “Tungsten and other Refractory Metals for VLSI Applications III”, edited by Wells, V. A. (Mai. Res. Soc. Proc., Pittsburgh, PA, 1988).Google Scholar
14 Yu, M. L., Eldridge, B. N., and Joshi, R. V., “Deposition and Growth: Limits for Microelectronics”, edited by Rubloff, G. W. (AIP Conf. Proc. 167, New York 1988), p. 202.Google Scholar
15 Broadbent, E. K. and Ramiller, C. L., J Elctrochem. Soc.: Solid-State Science and Technology, 1984, vol. 131, no 6, p. 1427.10.1149/1.2115864Google Scholar
16 Green, M. L and Levy, R. A., J Elctrochem. Soc.: Solid-State Science and Techonolgy, 1985, vol. 132, no 5, p. 1243.10.1149/1.2114081Google Scholar
17 Kepten, A., Reisman, A., Ray, M., Smith, P. L., Temple, D., and Tapp, F., J. Electrochem. Soc, vol. 139, no 8, Aug 1992, p. 2331.10.1149/1.2221226Google Scholar
18 Miller, S. L., Sniegowski, J. J., LaVigne, G., and McWhorter, P. J., “Friction in Surface Micromachined Microengines”, Proceedings of SPIE Smart Electronics and MEMS Vol. 2722, San Diego, Feb. 28-29, 1996, pp. 197204.Google Scholar
19 Tanner, Danelle M., Miller, W. M., Eaton, W. P., Irwin, L. W., Peterson, K. A., Dugger, M. T., Senft, D. C., Smith, N. F., Tangyunyong, P., and Miller, S. L., “The Effect of Frequency on the Lifetime of a Surface Micromachined Microengine Driving a Load, “1998 IEEE International Reliability Physics Proceedings, Reno, NV, 1998, pp. 2635.Google Scholar
20 Smith, Norman F., Eaton, William P., Tanner, Danelle M., and Allen, James J., “Development of characterization tools for reliability testing of MicroElectroMechanical system actuators”, SPIE's Vol. 3880, 1999, pp. 156164.Google Scholar