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Chemical Composition and Electrical Behavior of Contacts on Highly and Moderately Silicon-Doped (100) GaAs

Published online by Cambridge University Press:  22 February 2011

P. H. Holloway
Affiliation:
Dept. of Materials Science and Engineering, University of Florida, Gainesville, FL 32611
Y. -X. Wang
Affiliation:
Visiting Scientist from the Institute of Semiconductors, Chinese Academy of Sciences Beijing, People Republic of China.
Y. -J. Xie
Affiliation:
Visiting Scientist from Changchum Institute of Physics, Chinese Academy of Science, Changchun, Peoples Republic of China.
T. D. Bussing
Affiliation:
Dept. of Materials Science and Engineering, University of Florida, Gainesville, FL 32611
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Abstract

The effects of 1 to 5 keV Ar+ sputtering of (100) GaAs doped with >3 × 1018 cm−3 or <2 × 1017 cm−3 Si and contacted with 1000 Å of Au have been studied. Sputtering caused the contacts on highly doped GaAs to change from ohmic to rectifying, while it caused the Schottky barrier height on moderately doped GaAs to decrease. For both doping densities, barrier heights of ∼0.6 eV were measured. Inverse Laplace transform analysis of angle-resolved X-ray photoelectron spectroscopy data showed that As was preferentially sputtered, probably by a damage-assisted Gibbsian surface segregation mechanism. Modifications of the electrical contacts were explained by sputter-induced self-compensation by Si rearrangement and by damage-created shallow donors with a density of >2 × 1017 cm−3.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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References

REFERENCES

1. Buonaquisti, A. D., Wang, Y.-X., and Holloway, P. H., J. Vac. Sci. Technol. A1, 776 (1983).CrossRefGoogle Scholar
2. Wang, Y.-X. and Holloway, P. H., J. Vac. Sci. Technol. B2, 613 (1984).CrossRefGoogle Scholar
3. Buonaquisti, A. D., Matson, R. J., Russell, P. E., and Holloway, P. H., Surface Interf. Anal. 6, 279 (1984).CrossRefGoogle Scholar
4. Yamasaki, K., Asai, K., Shimada, K., and Makimura, T., J. Electrochem. Soc. 129, 2760 (1982).CrossRefGoogle Scholar
5. Wedhmer, L. S., Jamison, S. A., and Helus, M. T., J. Vac. Sci. Technol. 18, 8181 (1981).Google Scholar
6. Pang, S., Lincoln, G. A., McClelland, R. W., McGraff, P. D., Geis, M. W., and Piacientini, W. J., J. Vac. Sci. Technol. B1, 1334 (1983).CrossRefGoogle Scholar
7. Kwan, P., Bhat, K. N., Borrego, T. M., and Ghandhi, S. K., Solid State Electron. 26, 125 (1983).CrossRefGoogle Scholar
8. Bussing, T. and Holloway, P. H., J. Vac. Sci. Technol. A 3, 1355 (1985).CrossRefGoogle Scholar
9. Singer, I. L., Murday, J. S., and Cooper, L. K., Surf. Sci. 108, 7 (1981).CrossRefGoogle Scholar
10. Seah, M. P. and Dench, W., Surface Interf. Anal. 1, 3 (1979).Google Scholar
11. Blundell, R., Morgan, D. V., and Howes, M. H., Electronic Lett. 13, 483 (1977).CrossRefGoogle Scholar
12. Morgan, D. V. and Frey, J., Solid State Electronics 22, 865 (1979).CrossRefGoogle Scholar
13. Spitzer, W. G. and Allred, W., J. Appl. Phys. 39, 4999 (1968).CrossRefGoogle Scholar
14. Swartzfager, D., Ziemecki, S. B., and Kelley, M. J., J. Vac. Sci. Technol. 19, 185 (1981).CrossRefGoogle Scholar
15. Holloway, P. H. and Hofmeister, S. K., Surf. Interf. Anal. 4, 181 (1982).CrossRefGoogle Scholar
16. Kelly, R., Surf. Interf. Anal. 7, 1 (1985).CrossRefGoogle Scholar
17. Andersen, H. H. in The Physics of Ionized Gases, SPIG ‘80, Bubrovnik, August 1980, edited by Matic, M..Google Scholar