Hostname: page-component-8448b6f56d-tj2md Total loading time: 0 Render date: 2024-04-25T05:50:11.080Z Has data issue: false hasContentIssue false

Channeling Phenomena of Direct Si-Implantation to Liquid-Glass Encapsulation Czochralski GaAs Crystal Wafers Through Observation of Threshold Voltages

Published online by Cambridge University Press:  22 February 2011

Yasuyuki Saito
Affiliation:
Microelectronics Ctr., Tamagawa Works, Toshiba Corp., 1, Komukai Toshiba–cho, Saiwai–ku, Kawasaki 210, Japan
Katsuyoshi Fukuda
Affiliation:
Research and Development Ctr., Toshiba Corp., 1, Komukai Toshiba–cho, Saiwai–ku, Kawasaki 210, Japan
Get access

Abstract

Threshold voltages of Si-implanted gallium arsenide (GaAs) MESFETs depend on not only wafer crystallographic characteristics, but also MESFET fabrication processes. When the position of the orientation flat was changed to improve mechanical shock tolerance, it was found that Vth varied on the wafers due to a crystallographic orientation effect on the Si implantation. Thus, we investigated Vth distributions on wafers of several different Si implantation orientations. It was confirmed that Vth largely varies according to Si-implantation orientations.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Saito, Y., R&D report. RR-3331.Google Scholar
2 Saito, Y., J.Appl.Phys. 65., 846 (1989),(Erratum) 65, 2232 (1989).Google Scholar
3 Saito, Y., J.Appl.Phys. 72., 5451 (1992).Google Scholar
4 Saito, Y., presented at the Jpπ.Soc.Appl.Phys. and Related Socs.39th spring meeting(1992), in the Extended Abstracts (JSAP Cat.Num.AP-921108-03), 30p-S-13, p.1163.Google Scholar
5 Saito, Y., in the Materials Research Society Symposium Procs. Vol.262, eds. Ashok, S., Chevallier, J., Sumino, K. and Weber, E., pp.719723.Google Scholar
6 Saito, Y., J.Appl.Phys. 71, 3544 (1992).Google Scholar
7 Saito, Y., Fukuda, K. and Yasuami, S., R&D report. RM25565.Google Scholar
8 Fukuda, K., Usuda, K., Saito, Y., Yoshida, H. and Yasuami, S., R&D report. RM25993.Google Scholar
9 Saito, Y., Fukuda, K., Nozaki, C., Yasuami, S., Nishio, J., Yashiro, S., Washizuka, S., Watanabe, M., Hirose, M., Kitaura, Y. and Uchitomi, N., Jpn.J.Appl.Phys. 30, 2432 (1991).Google Scholar
10 Saito, Y., in the Materials Research Society Symposium Procs. Vol.300, eds. Jones, K.S., Pearton, S.J. and Kanber, H., pp.267272.Google Scholar
11 Saito, Y., presented at the 9th Int.Conf.on Ternary and Multinary compounds (ICTMC9) Aug. 11, 1993, Yokohama, Japan), submitted proceedings paper (#224).Google Scholar
12 Saito, Y., in the Procs. of the 1st Int.Symposium on Laser and Optoelectronics Technology Applications (ISLOE'93) eds. T.C.Chong and Y.F.Lu (Nov. 12, 1993, Singapore), pp.330-335.Google Scholar
13 Nagaoka, M., his work of the evaporation apparatus.Google Scholar
14 Saito, Y., his work of the present experiment,Google Scholar
15 Ishida, K., his work of the E-gun evaporation apparatus.Google Scholar
16 Saito, Y., his work of the present experiment,Google Scholar
17 Saito, Y., his work of the present experiment,Google Scholar
18 Ohashi, , Yamaguch and Watanabe, their work of the mask aligner.Google Scholar
19 Saito, Y., his commision work to Toppan Printing.Google Scholar
20 Saito, Y., his work of the present experiment,Google Scholar
21 Watanabe, M., Washizuka, S., Satao, S., Nakajima, M., Akatsuka, , Nishio, J. and their colleagues, their work on Cambridge Instrument CI358 pullers (especially, No.5 and No.7 related to the present work sample wafers) in Hamaoka denshi buhin (now Hamaoka Toshiba).Google Scholar
22 Washizuka, S., Nishio, J., Terashima, K. and Watanabe, M., in Semi-Insulating III-V Materials, eds. Kukimoto, H. and Miyazawa, S. (Ohmsha, Tokyo, 1986), pp.6570.Google Scholar
23 Saito, Y., presented at the Jpn.Soc.Appl.Phys and Related Socs.39th Spring Meeting (1992), Y. Saito, J. Nishio, K. Terashima, S. Yashiro, S. Washizuka, M. Watanabe, S. Takami, M. Nakajima in the Extended Abstracts (JSAP Cat.Num.AP-921108-03), 30p-S-14, p.1163.Google Scholar
24 Ishimura, H., Izumi, H., and Onose, H., their work on the implantation apparatus.Google Scholar
25 Onose, H., his work of the present experiment process of implantation.Google Scholar
26 Saito, Y., presented at the 5th Int.Conf. on Defect Recognition and Image Processing in Semiconductors and Devices (DRIP-5) (Sept. 10, 1993), CЗЗ in the Abstracts, Y. Saito, M.Hirose and Y.Ikawa in the proceedings.Google Scholar
27 Saito, Y., his work of the present experiment.Google Scholar
28 Hilibrand, J. and R.D.Gold, RCA Rev.2l, 245 (1960).Google Scholar
29 Saito, Y. and Yasuami, S., R&D report. RM24401.Google Scholar
30 Saito, Y. and Nishio, J., in the Materials Research Society Symposium Procs. Vol. 300, eds. Jones, K.S., Pearton, S.J. and Kanber, H., pp.507512.Google Scholar
31 Saito, Y., his work of the present experiment.Google Scholar
32 Saito, Y., his work at R&D center Electric parts lab. in the ULSI lab. building.Google Scholar