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Adhesion Reliability of Cu-Cr Alloy Films to Polyimide

Published online by Cambridge University Press:  15 February 2011

E. C. Ahn ,
Jin Yu ,
T. C. Oh  and
I. S. Park
E. C. Ahn
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
Jin Yu
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
T. C. Oh
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
I. S. Park
Affiliation:
Department of Materials Science and Engineering, KAIST, Chongryang P.O.BOX 201, Seoul, Korea
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Abstract

CuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide films were maintained under 350°C/N2 environment up to 10 hours for reliability measurements. Before exposure to 350°C, the peel strength increased proportionally with the Cr content in the alloy layer up to 17% and saturated. After exposure to 350°C, the peel strength dropped for all the specimens due to the formation of Cr2O3 at the metal/polyimide interface, and the effect was most drastic for the specimen with the lowest Cr content, which failed along the Cr-oxide/polyimide interface. Depletion of carbidic bonds at the metal/polyimide interface accompanied the oxide formation, and the result was quite devastating for the specimens with low Cr content in the alloy layer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 428: Symposium L – Materials Reliability in Microelectronics VI , 1996 , 67
Copyright
Copyright © Materials Research Society 1996

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