Hostname: page-component-848d4c4894-tn8tq Total loading time: 0 Render date: 2024-06-24T01:56:20.284Z Has data issue: false hasContentIssue false
  • English
  • Français

Acoustic Emissions During Indentation Tests

Published online by Cambridge University Press:  22 February 2011

T P Weihs ,
C W Lawrence ,
B Derby ,
C B Scruby  and
J B Pethica
T P Weihs
Affiliation:
Department of Materials, Parks Rd, Oxford, OX1 3PH, UK
C W Lawrence
Affiliation:
Department of Materials, Parks Rd, Oxford, OX1 3PH, UK
B Derby
Affiliation:
Department of Materials, Parks Rd, Oxford, OX1 3PH, UK
C B Scruby
Affiliation:
also at National NDT Centre, AEA Technology, Harwell Laboratory, UK
J B Pethica
Affiliation:
Department of Materials, Parks Rd, Oxford, OX1 3PH, UK
Get access

Abstract

When a hard tip indents a sample, cracking, delamination and plasticity can all produce acoustic signals in the form of elastic waves. This paper describes how these acoustic emissions (AE) can be monitored using piezoelectric elements and a load-controlled indentation instrument. Signals emitted from thin films and bulk materials are shown and they are correlated with distinct jumps in displacement of the indenter tip. The benefits and difficulties of different methods of monitoring the emissions are also considered.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 361
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1) Scruby, C B, J. Phys. E: Sci Instram. 20, 946 (1987).CrossRefGoogle Scholar
2) Nano Instruments, Inc., P.O. Box 14211, Knoxville, TN 37914.Google Scholar
3) Zygo Corp., Laurel Brook Rd., Middlefield, CT 06455.Google Scholar
4) Weihs, T P and Nix, W D, Ser. Metall. 22, 271 (1988).CrossRefGoogle Scholar
5) Cook, R F and Pharr, G M, J. Am. Ceram. Soc. 21, 787 (1990).CrossRefGoogle Scholar
6) Marshall, D B, Lawn, B R and Evans, A G, J. Am. Ceram. Soc. 65, 561 (1982).CrossRefGoogle Scholar
7) Lawn, B R, Evans, A G and Marshall, D B, J. Am. Ceram. Soc. 63, 574 (1980).CrossRefGoogle Scholar
8) Lawn, B R and Wilshaw, R, J. Mat. Sci. 10, 1049 (1975).CrossRefGoogle Scholar
9) Evans, A G and Marshall, D B, Mat. Res. Soc. Symp. Proc. 120, 213 (1988).CrossRefGoogle Scholar
10) Pharr, G M, Mat. Res. Soc. Symp. Proc., Fall 1991, to be published.Google Scholar
11) Page, T F, Oliver, W C and McHargue, C J, submitted to J Mater. Res.Google Scholar
12) Clarke, D R, Kroll, M C, Kirchner, P D, and Cook, R F, Phys. Rev. Lett, 60, 2156 (1988).CrossRefGoogle Scholar
13) Hu, J Z, Merkle, L D, Menoni, C S and Spain, IL, Phys. Rev. B 34, 4679 (1986).CrossRefGoogle Scholar
14) Gupta, M C and Ruoff, A L, J. Appl. Phys. 51, 1072 (1980).CrossRefGoogle Scholar
15) Sumojami, T., Kuwahara, K and Fujiyama, H, Thin Solid Films 87, 337 (1981).Google Scholar
16) Marshall, D B and Evans, A G, J Appl. Phys. 56, 2632 (1986).CrossRefGoogle Scholar
17) Pethica, J.B. and Oliver, W.C., Mat. Res. Soc. Symp. Proc. 130 13 (1989).CrossRefGoogle Scholar