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Transient Thermoelectric Cooling of thin Film Devices

Published online by Cambridge University Press:  01 February 2011

A. Ravi Kumar
Affiliation:
Mechanical and Aerospace Engineering Department, University of California at Los Angeles, Los Angeles, CA 90095–1597
R.G. Yang
Affiliation:
Mechanical and Aerospace Engineering Department, University of California at Los Angeles, Los Angeles, CA 90095–1597
G. Chen
Affiliation:
Mechanical and Aerospace Engineering Department, University of California at Los Angeles, Los Angeles, CA 90095–1597
J.-P. Fleurial
Affiliation:
Jet Propulsion Laboratory/California Institute of Technology, 4800 Oak Grove Drive, MS 277–207, Pasadena, California 91109
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Abstract

We report theoretical analysis for the transient thermal response of thermoelectric (TE) element and the integrated thin-film devices. It is predicted that the TE element geometry and applied current pulse shape influences the transient response of the system. Analysis for the integrated systems shows that the transient response is affected by the effusivity of the attached mass. This analysis provides a means to examine the effectiveness of thermal management of the thin-film devices, particularly semiconductor lasers, using the transient mode operation of thermoelectric coolers, and also suggests geometry constraints and optimum pulse shapes for an integrated system.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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