Skip to main content Accessibility help
×
Home
Hostname: page-component-55597f9d44-dfw9g Total loading time: 0.295 Render date: 2022-08-15T00:13:12.495Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "useRatesEcommerce": false, "useNewApi": true } hasContentIssue true

Transient Electrochemical Measurements During Copper Chemical Mechanical Polishing

Published online by Cambridge University Press:  01 February 2011

Seung-Mahn Lee
Affiliation:
Department of Materials Science and Engineering and Particle Engineering Research CenterUniversity of Florida, Gainesville, FL 32611, U.S.A.
Wonseop Choi
Affiliation:
Department of Materials Science and Engineering and Particle Engineering Research CenterUniversity of Florida, Gainesville, FL 32611, U.S.A.
Valentin Craciun
Affiliation:
Department of Materials Science and Engineering and Particle Engineering Research CenterUniversity of Florida, Gainesville, FL 32611, U.S.A.
Rajiv K. Singh
Affiliation:
Department of Materials Science and Engineering and Particle Engineering Research CenterUniversity of Florida, Gainesville, FL 32611, U.S.A.
Get access

Abstract

Chronoamperometry was used to investigate the reaction/passivation kinetics and thickness of the chemically modified surface layer on the copper during chemical mechanical polishing (CMP). The result showed that the reaction/passivation kinetics and the thickness of the chemically modified surface layer are strongly dependent on the chemistry of CMP slurry in the chemical aspect of CMP and play critical keys in the selection of the chemistry and its concentration. BTA and H2O2 enhanced the passivation kinetics, resulting in thinner layer on the copper surface. In addition, the reaction kinetics increased as pH decreased.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Preston, F. J. Soc. Glass Technol. 112, 14 (1927)Google Scholar
[2] Brown, N. J. Baker, P. C. and Maney, R. T., Proc. SPIE 306, 42 (1981)Google Scholar
[3] Steigerwald, J. M. Murarka, S. P. and Gutmann, R. J. Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, New York (1997)CrossRefGoogle Scholar
[4] Yu, Y. Yu, C.C. and Orlowski, M. IEEE IEDM, 865 (1993)Google Scholar
[5] Basim, G. B. Ph.D. dissertation, University of Florida (2002)Google Scholar
[6] Choi, W. Lee, S.-M., and Singh, R. K. Proceeding of Material Research Society spring meeting, Material Research Society, San Francisco, 671, M5.1.1 (2001)Google Scholar
[7] Hernandez, J. Wrschka, P. and Oehrlein, G. S. J. Electro. Chem. Soc., 148, G389 (2001)CrossRefGoogle Scholar
[8] Stein, D. J. Hetherington, D. L. Guilinger, T. and Cecchi, J. L. J. Electrochem. Soc. 145, 3190 (1998)CrossRefGoogle Scholar
[9] Stein, D. J. Cecchi, J. L. and Hetherington, D. L. J.Mat. Res. 14, 3695 (1999)CrossRefGoogle Scholar
[10] Nguyen, H. V. Ph.D. Dissertation, Universiteit Twente (2001)Google Scholar
[11] Bielmann, M. Mahajan, U., Singh, R. K. Agarwal, P., Mischler, S., Rosset, E., and Landolt, D., Materials Research Society Symposium – Proceedings, 566, 97 (2000)Google Scholar
[12] Carpio, R., Farkas, J. and Jairath, R., Thin Solid Films, 266, 238 (1995)CrossRefGoogle Scholar
[13] Pourbaix, M., “Atlas Of Electrochemical Equilibria In Aqueous Solution”, Nace, Houston, Tx (1974)Google Scholar

Save article to Kindle

To save this article to your Kindle, first ensure coreplatform@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about saving to your Kindle.

Note you can select to save to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be saved to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Transient Electrochemical Measurements During Copper Chemical Mechanical Polishing
Available formats
×

Save article to Dropbox

To save this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Dropbox account. Find out more about saving content to Dropbox.

Transient Electrochemical Measurements During Copper Chemical Mechanical Polishing
Available formats
×

Save article to Google Drive

To save this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Google Drive account. Find out more about saving content to Google Drive.

Transient Electrochemical Measurements During Copper Chemical Mechanical Polishing
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *