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Thermomechanical behavior and microstructural evolution in tantalum thin films

Published online by Cambridge University Press:  01 February 2011

Robert Knepper
Affiliation:
Cornell University, Department of Materials Science and Engineering Ithaca, NY 14853, U.S.A.
Katherine Jackson
Affiliation:
Cornell University, Department of Materials Science and Engineering Ithaca, NY 14853, U.S.A.
Blake Stevens
Affiliation:
Cornell University, Department of Materials Science and Engineering Ithaca, NY 14853, U.S.A.
Shefford P. Baker
Affiliation:
Cornell University, Department of Materials Science and Engineering Ithaca, NY 14853, U.S.A.
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Abstract

Ta films were prepared in the metastable β phase using an ultra-high vacuum sputter deposition system. The stresses that arose during thermal cycles to 750°C were measured using an in situ substrate curvature measurement system, allowing oxygen content in the films to be minimized. A phase transformation from β to the stable α phase takes place in conjunction with distinct “jumps” in stress in the tensile direction during heating at approximately 400°C and 650°C. X-ray and electron backscatter diffraction (EBSD) analyses were used to determine grain sizes, along with crystal phase and orientation information. These results indicate a significant amount of grain growth accompanying the phase transformation. It is found that the measured total stress change is in reasonable agreement with that predicted by the combination of grain growth, crystal densification associated with the phase transformation, and stress relaxation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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