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Thermal Degradation of Tantalum-Nickel Thin Film Couples

Published online by Cambridge University Press:  15 February 2011

M. H. Tabacniks
Affiliation:
IBM -Almaden Research Center, 650 Harry Rd. San Jose, CA95120, USA University of São Paulo, CP 66318, São Paulo, SP, Brazil
A.J. Kellock
Affiliation:
IBM -Almaden Research Center, 650 Harry Rd. San Jose, CA95120, USA
J.E.E. Baglin
Affiliation:
IBM -Almaden Research Center, 650 Harry Rd. San Jose, CA95120, USA
K.R. Coffey
Affiliation:
IBM Storage Systems Division, San Jose. 5600 Cottle Rd. San Jose, CA95193, USA
J.K. Howard
Affiliation:
IBM Storage Systems Division, San Jose. 5600 Cottle Rd. San Jose, CA95193, USA
M.A. Parker
Affiliation:
IBM Storage Systems Division, San Jose. 5600 Cottle Rd. San Jose, CA95193, USA
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Abstract

Multilayered metal films including such couples as Ta-Permalloy (Ni80Fe20) play a key role in magnetic recording sensors, where it is important to preserve the integrity of the thin permalloy layer under thermal conditions during processing and subsequent service. Earlier work1 has indicated a fast grain boundary diffusion of Ta in Ni films at temperatures as low as 250°C. In this paper, we report measurements of the kinetics of this diffusion, in the temperature range 300–400°C. For this work, layered Ni/Ta systems were prepared under controlled conditions, annealed in a helium-flow furnace, and characterized by RBS, AES, XRD and SEM. The possible consequences of diffusion on magnetic performance are also discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

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