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Thermal Characterization of Micro/Nanoscale Wires/Tubes Using Pulsed Laser-assisted Thermal Relaxation

Published online by Cambridge University Press:  01 February 2011

Jiaqi Guo
Affiliation:
ice322onion@hotmail.com, University of Nebraska-Lincoln, Mechanical Engineering, 1326 D St. Apt.2, Lincoln, NE, 68588, United States
Xinwei Wang
Affiliation:
xwang3@unl.edu, University of Nebraska-Lincoln, Mechanical Engineering, Lincoln, NE, 68588-0656, United States
David Geohegan
Affiliation:
geohegandb@ornl.gov, Oak Ridge National Laboratory, 1 Bethel Valley Road, MS-6056, Oak Ridge, TN, 37831-6056, United States
Gyula Eres
Affiliation:
eresg@ornl.gov, Oak Ridge National Laboratory, 1 Bethel Valley Road, MS-6056, Oak Ridge, TN, 37831-6056, United States
Cecile Vincent
Affiliation:
vincent@icmcb-bordeaux.cnrs.fr, University of Bordeaux I, 87 avenue A. Schweitzer, Pessac, 33600, France
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Abstract

A novel transient technique is developed to measure the thermal diffusivity of one-dimensional microscale wires. In this technique, the thin wire is suspended over two copper electrodes. Upon fast (nanosecond) pulsed laser irradiation, the wire's temperature will quickly increase to a high level and then decrease gradually. Such temperature decay can be used to determine sample's thermal diffusivity. To probe this temperature evolution, a dc current is fed through the wire to sensor its voltage variation, from which the thermal diffusivity can be extracted. A 25.4-μ;m thin Pt wire is characterized to verify this technique. Sound agreement is obtained between the measured data and reference value. Applying this pulsed laser-assisted thermal relaxation technique, the thermal diffusivity of multi-wall carbon nanotube bundles and microscale carbon fibers is measured. Detailed analysis is conducted to study the effect of the wire embedded in the paste/base on the final measurement result.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

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