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Submicrometer-Sized Polystyrene Particles Packing on Silicon Microfabricated Substrate

Published online by Cambridge University Press:  26 February 2011

Manabu Tanaka
Affiliation:
tanaka@moegi.waseda.jp, Waseda University, Department of Applied Chemistry, 3-4-1 Okubo, Shinjuku, Tokyo, N/A, 169-8555, Japan, +81-3-3200-2669, +81-3-3209-5522
Naonobu Shimamoto
Affiliation:
shimamoto@ohdomari.comm.waseda.ac.jp, Waseda University, Department of Electrical Engineering and Bioscience, Japan
Takashi Tanii
Affiliation:
tanii@ohdomari.comm.waseda.ac.jp, Waseda University, Department of Electrical Engineering and Bioscience, Japan
Iwao Ohdomari
Affiliation:
ohdom@waseda.jp, Waseda University, Department of Electrical Engineering and Bioscience, Japan
Hiroyuki Nishide
Affiliation:
nishide@waseda.jp, Waseda University, Department of Applied Chemistry, Japan
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Abstract

The Packing of submicrometer-sized polystyrene particle within micro-boxes; micrometer-sized squarely recessed pits, was achieved using silicon microfabricated substrates and a simple dipping and pulling-up process. A special phenomenon, cubic packing structures of the particles, was observed when using a micro-box substrate with a few times larger side-length than the particle diameters. Several particle packing structures within different sized micro-boxes were demonstrated, and the relationship between the particle packing structures and micro-box sizes were discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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Submicrometer-Sized Polystyrene Particles Packing on Silicon Microfabricated Substrate
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