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Sub Surface Material Characterization using High Frequency Eddy Current Spectroscopy

Published online by Cambridge University Press:  31 January 2011

Henning Heuer
Affiliation:
henning.heuer@izfp-d.fraunhofer.de, Fraunhofer, IZFP Dresden, Dresden, Germany
Susanne Hillmann
Affiliation:
susanne.hillmann@izfp-d.fraunhofer.de, Fraunhofer, IZFP-D, Dresden, Germany
Marcus Klein
Affiliation:
marcus.klein@izfp-d.fraunhofer.de, Fraunhofer, IZFP-D, Dresden, Germany
Norbert Meyendorf
Affiliation:
norbert.meyndorf@izfp-d.fraunhofer.de, Fraunhofer, IZFP-D, Dresden, Germany
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Abstract

By launching new processes introduced by nano science into much more conventional industrial applications fast, robust and economical reasonable inspection methods are required for process control and quality assurance. Coming from high tech industries e.g. semiconductor industries the methods available for thin film characterization and quality control are complex and often require scientific skilled personal. High frequency eddy current spectroscopy in reflection or transmission configuration allows a contactless measurement of e.g. copper thin films on silicon with a thickness resolution better that 5 nm. Due to the insensitivity of the transmission mode to dislocations or slight tilting of the sample the high frequency eddy current method is a practicable method for thin film characterization under industrial environment.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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References

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