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The Reaction Kinetics of Liquid 60/40 Sn/Pb Solder With Copper and Nickel: A High Temperature X-Ray Diffraction Study

Published online by Cambridge University Press:  22 February 2011

Patrick W. Dehaven*
Affiliation:
IBM Corporation, Zip 41C, Route 52, Hopewell Junction, NY 12533
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Abstract

With proper sample preparation, high temperature x-ray diffraction can be used to study in-situ the reactions occurring at a solder/metal interface. We have applied this technique to an investigation of the reaction kinetics between copper and nickel metal and 60/40 Sn/Pb solder. The copper and nickel are shown to follow similar pathways, each having a complex reaction profile that involves an initial “hold” of little reactivity, followed by a two-step diffusion controlled reaction. Activation energies were obtained from Arrhenius-type plots, and result in values of 6.8 kcal/mole for the nickel/solder reaction, and 13 kcal/mole for the copper/solder reaction. These results are compared with those obtained by previous investigators, and discussed in terms of the growth of the different intermetallic phases.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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