Skip to main content Accessibility help
×
Home
Hostname: page-component-564cf476b6-qp9dn Total loading time: 7.684 Render date: 2021-06-22T21:36:41.241Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": true, "newCiteModal": false, "newCitedByModal": true, "newEcommerce": true }

Oxidation Resistance of Copper Alloy Thin Films Formed by Chemical Vapor Deposition

Published online by Cambridge University Press:  15 February 2011

P. Atanasova
Affiliation:
Center for Micro-Engineered Materials, University of New Mexico, Albuquerque, NM 87131
V. Bhaskaran
Affiliation:
Departments of Chemical & Nuclear Engineering, University of New Mexico, Albuquerque, NM 87131
T. Kodas
Affiliation:
Departments of Chemical & Nuclear Engineering, University of New Mexico, Albuquerque, NM 87131 Center for Micro-Engineered Materials, University of New Mexico, Albuquerque, NM 87131
M. Hampden-Smith
Affiliation:
Chemistry, University of New Mexico, Albuquerque, NM 87131 Center for Micro-Engineered Materials, University of New Mexico, Albuquerque, NM 87131
Get access

Abstract

Co-deposition of copper-palladium alloy films was demonstrated using low-pressure CVD from individual precursors - (hexafluoroacetylacetonato)copper(I)(vinyltrimethylsilane) [(hfac)Cu(I)vtms] and palladium(II)bis(hexafluoroacetylacetonate) [Pd(hfac)2], for Cu and Pd respectively. High-purity alloy films with controlled composition, microstructure and morphology were prepared and their oxidation behavior was examined at different temperatures and compared with that of pure copper CVD films with similar morphology. As-deposited copper-palladium alloy films showed improved resistance to oxidation up to 300°C in air. Enhanced oxidation resistance compared to Cu CVD films was observed at concentrations of palladium as low as 0.5 at. %.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below.

References

1. Shih, D.-Y., Kim, J., Walker, G.F., Chang, C-A., Paraszczak, J., Yang, C., Appl. Phys. Lett., 59 (12), 1424 (1991)CrossRefGoogle Scholar
2. Li, J., Mayer, J.W., Colgan, E.G., J. Appl. Phys., 70 (5), 2820 (1991)CrossRefGoogle Scholar
3. Itow, H., Nakasaki, Y., Minamihaba, G., Suguro, K., Okano, H., Appl. Phys. Lett., 63 (7), 93 (1993)CrossRefGoogle Scholar
4. Cvitkovic, R., Ivey, D.G., Stiles, J., J. Mater. Sci., 30, 5415 (1995)Google Scholar
5. Lanford, W.A., Ding, P.J., Wang, W., Hymes, S., Murarka, S.P., Mater. Chem. Physics., 42, 192 (1995)CrossRefGoogle Scholar
6. Lanford, W.A., Ding, P.J., Wang, W., Hymes, S., Murarka, S.P., Thin Solid Films, 262, 234 (1995)CrossRefGoogle Scholar
7. Ding, P.J., Lanford, W.A., Hymes, S., Murarka, S.P., J. Appl. Phys., 74, 1331 (1993)CrossRefGoogle Scholar
8. Hymes, S., Murarka, S.P., Shepard, C. and Landford, W.A., J. Appl. Phys., 71(9), 4623 (1992)CrossRefGoogle Scholar
9. Ding, P.J., Lanford, W.A., Hymes, S., Murarka, S.P., J. Appl. Phys., 75 (7), 3627 (1994)CrossRefGoogle Scholar
10. Cabral, C. Jr, Harper, J.M.E., Holloway, K., Smith, D.A., Schad, R.G., J. Vac. Sci. Technol. A, 10 (4), 1706 (1992)CrossRefGoogle Scholar
11. Hu, C.-K., Luther, B., Kaufman, F.B., Hummel, J., Uzon, C., Pearson, D.J., Thin Solid Films, 262, 84 (1995)CrossRefGoogle Scholar
12. CRC Handbook of Electrical Resistivities of Binary Metallic Alloys, edited by Schroder, K., Chemical Rubber, Boca Raton, FL, 1983, pp. 25 Google Scholar
13. Strawbridge, A., Rapp, R.A., J. Electrochem. Soc., 141 (7), 1905 (1994)CrossRefGoogle Scholar
14. Park, C.W., Vook, R.W., Thin Solid Films, 226, 238 (1993)CrossRefGoogle Scholar
15. Smart, Chr.J., Reynolds, Sc.K., Stains, C.L., Patil, Arv., Kirleis, J.Th., Mat. Res. Symp. Proc., 282, 229 (1993)CrossRefGoogle Scholar
16. Doppelt, P., Baum, Th. H., Thin Solid Films, 270 (1995) 480 CrossRefGoogle Scholar
17. Bhaskaran, V., Atanasova, P., Ludviksson, A., Hampden-Smith, M., Kodas, T., presented at the Advanced Metallization Conference, Portland, Oregon, 1995 (in print)Google Scholar
18. Sundararaman, M., Sharna, S.K., Kumar, L., Krishnan, R., Nuclear Instruments and Methods, 191, 289 (1981)CrossRefGoogle Scholar
19. Cullity, B.D., Elements of X-Raty Diffraction, Addison-Wesley Publishing Company, Reading, Massachusetts, 1978, pp. 377 Google Scholar

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Oxidation Resistance of Copper Alloy Thin Films Formed by Chemical Vapor Deposition
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Oxidation Resistance of Copper Alloy Thin Films Formed by Chemical Vapor Deposition
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Oxidation Resistance of Copper Alloy Thin Films Formed by Chemical Vapor Deposition
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *