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Oxidation behavior of TiN with a Ti interlayer on stainless steel

Published online by Cambridge University Press:  15 March 2011

Ming-Hua Shiao
Affiliation:
Precision Instrument Development Center, National Science Council, Hsinchu 300, Taiwan
Ching-Chiun Wang
Affiliation:
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan
Chien-Ying Su
Affiliation:
Precision Instrument Development Center, National Science Council, Hsinchu 300, Taiwan
Fuh-Sheng Shieu
Affiliation:
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan
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Abstract

Characterization of the TiN coatings oxidized in air at temperatures at 600 and 700°C for 30 min was carried out by X-ray diffraction (XRD), atomic force microscopy (AFM), transmission electron microscopy (TEM) and Auger electron spectroscopy (AES). TiN thin films with a Ti interlayer were prepared by hollow cathode discharge ion plating on AISI 304 stainless steel. Both XRD and TEM results show that the TiN coatings and Ti interlayer have columnar structure with (111) and (0002) preferred orientations, respectively. AFM results show the existence of pinholes on the surface of specimens due to electropolishing process of the steel substrate, and the surface roughness (Ra) changes from 3.5 nm for the as-deposited specimen to 11.6 nm after oxidation at 700°. After oxidation, the TiO2 oxide layer formed on the specimen surface was porous and retained the columnar structure as the original TiN coating. The microstructure of the Ti interlayer gradually changed from columnar to polycrystalline structure due to grain growth. The Auger elemental depth profiling indicated that interdiffusion of the Ti interlayer with steel substrate had occurred during the oxidation process.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

1. Lang, F. and Yu, Z., Surf. Coat. Technol., 145, 80 (2001).Google Scholar
2. Guu, Y. Y., Lin, J. F. and Ai, C. F., Thin Solid Films, 302, 193 (1997).Google Scholar
3. Cho, C. W. and Lee, Y. Z., Wear, 254, 383 (2003).Google Scholar
4. Shieu, F. S., Cheng, L. H., Shiao, M. H. and Lin, S. H., Thin Solid Films, 311, 138 (1997).Google Scholar
5. Wang, C. C., Hsieh, W. P., Shiao, M. H., Lin, J. H. and Shieu, F. S., J. Electrochem. Soc., 150, B199 (2003).Google Scholar
6. Ichimura, H. and Kawana, A., J. Mater. Res., 8, 1093 (1993).Google Scholar
7. Vancoille, E., Blanpain, B., Xingpu, Y., Celis, J. P. and Roos, J. R., J. Mater. Res., 9, 992 (1994).Google Scholar
8. Prieto, P. and Kirby, R. E., J. Vac. Sci & Technol. A, 13, 2819 (1995).Google Scholar
9. Milosev, I., Strehblow, H. H. and Navinsek, B., Surf. Coat. Technol., 74–75, 897 (1995).Google Scholar
10. Milosev, I., Strehblow, H. H. and Navinsek, B., Thin Solid Films, 303, 246 (1997).Google Scholar
11. Ensinger, W., Nucl. Instrum. Met. Phys. Res. B, 127–128, 796 (1997).Google Scholar