Skip to main content Accessibility help
×
Home
Hostname: page-component-dc8c957cd-jlg5l Total loading time: 0.266 Render date: 2022-01-28T20:18:15.183Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": true, "newCiteModal": false, "newCitedByModal": true, "newEcommerce": true, "newUsageEvents": true }

Morphology of Ti37Al63 Thin-Films Deposited by Magnetron Sputtering

Published online by Cambridge University Press:  17 March 2011

N. David Theodore
Affiliation:
DigitalDNA™ Labs., Motorola Inc., 2100 E. Elliot Rd., MD-EL622, Tempe, AZ 85284, U.S.A
Hyunchul C. Kim
Affiliation:
Department of Chemical and Materials Engineering, Arizona State University, Tempe, AZ 85287, U.S.A
Kaustubh S. Gadre
Affiliation:
Intel Corp., RA3-402, 2501 NW 229th St., Hillsboro, OR 97124, U.S.A
James W. Mayer
Affiliation:
Department of Chemical and Materials Engineering, Arizona State University, Tempe, AZ 85287, U.S.A
Terry L. Alford
Affiliation:
Department of Chemical and Materials Engineering, Arizona State University, Tempe, AZ 85287, U.S.A
Get access

Abstract

TiAl based thin-films possess high oxidation-resistance and high melting points, making them possible candidates for application in electronics. The behavior of the films upon exposure to various temperatures is of interest for such application. In the present study, Ti37Al63 thin films were deposited onto SiO2 substrates using RF magnetron sputtering from a compound target. Anneals were performed in vacuum at temperatures ranging from 400 °C to 700 °C. The phases and microstructural behavior of the films were evaluated as a function of annealing. Microstructural behavior was correlated with resistivity changes in the films. The behavior of Ti-Al films as potential under-layers for silver metallization was also evaluated. The Ti-Al was observed to enhance the thermal stability of pure Al thin-films. The results are relevant for potential application of the films to electronics.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Zhang, J., Reddy, B. V., Deevi, S. C., Scripta Mater. 45, 645 (2001).CrossRefGoogle Scholar
2. Veeraraghavan, D., Pilchowski, U., Natarajan, B., Vasudevan, V. K., Acta Mater. 46, 405 (1998).CrossRefGoogle Scholar
3. Viera, T., Trindade, B., Ramos, A.S., Fernandes, J.V., Vieira, M.F., Mat. Sci. Eng. A329–331, 147 (2002).CrossRefGoogle Scholar
4. Senkov, N., Uchic, M.D., Mat. Sci. Eng. A340, 216 (2003).CrossRefGoogle Scholar
5. Wang, Z., Shao, G., Tsakiropoulos, P., Wang, F., Mat. Sci. Eng. A329–331, 141 (2002).CrossRefGoogle Scholar
6. Banerjee, R., Swaminathan, S., Wiezorek, J.M.K., Wheeler, R., Fraser, H.L., Metall. Mater. Trans. A 27, 2047 (1996).CrossRefGoogle Scholar
7. Lei, C., Xu, Q., Sun, Y.Q., Mat. Sci. Eng. A313, 227 (2001).CrossRefGoogle Scholar
8. Herzig, C., Przeorski, T., Mishin, Y., Intermetallics 7, 389 (1999).CrossRefGoogle Scholar
9. Herzig, C., Friesel, M., Derdau, D., Divinski, S.V., Intermetallics 7, 1141 (1999).CrossRefGoogle Scholar
10. Herzig, C., Wilger, T., Przeorski, T., Hisker, F., Divinski, S., Intermetallics 9, 431 (2001).CrossRefGoogle Scholar
11. Kim, H.C., Theodore, N.D., Gadre, K.S., Mayer, J.W., Alford, T.L., in press, Thin Solid Films, (2004).Google Scholar
12. Kittel, C., Introduction to Solid State Physics, 7th ed. (Willey, New York, 1996), p. 530.Google Scholar
13. Mooij, J. H., Phys. Stat. Sol (a) 17, 521 (1973).CrossRefGoogle Scholar
14. Shirai, Y., Masaki, K., Inoue, T., Nishitani, S. R., Yamaguchi, M., Intermetallics 3, 381 (1995).CrossRefGoogle Scholar

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Morphology of Ti37Al63 Thin-Films Deposited by Magnetron Sputtering
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Morphology of Ti37Al63 Thin-Films Deposited by Magnetron Sputtering
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Morphology of Ti37Al63 Thin-Films Deposited by Magnetron Sputtering
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *