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High-Throughput Screening of Thermoelectric Materials; Application of Thermal Probe Method to Composition-Spread Samples

Published online by Cambridge University Press:  01 February 2011

Atsushi Yamamoto
Affiliation:
Energy Electronics Institute, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, JAPAN
Dmitry Kukuruznyak
Affiliation:
Nanomaterials Laboratory, National Institute for Materials Science (NIMS), Tsukuba, JAPAN
Parhat Ahmet
Affiliation:
Nanomaterials Laboratory, National Institute for Materials Science (NIMS), Tsukuba, JAPAN
Toyohiro Chikyow
Affiliation:
Nanomaterials Laboratory, National Institute for Materials Science (NIMS), Tsukuba, JAPAN
Fumio S. Ohuchi
Affiliation:
Department of Materials Science and Engineering, University of Washington, Seattle, WA
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Abstract

In this paper, we demonstrate the use of thermal probe method that is capable of mapping Seebeck coefficient, thermal conductivity and contact resistance on a micrometer scale. We show the successful screening example on pseudo binary (Bi1−xSbx)2Te3 (0.5<x<1) bulk composition-spread sample prepared by conventional powder metallurgy process. Another demonstration is a novel attempt to combine the combinatorial PLD and the thermal probe method. A pseudo ternary diagram of nickel-copper-manganese oxides fabricated on Nb doped STO substrate was used for the screening. The mapping of electrical resistance over the ternary diagram yields a lot of information, which is essential for materials researches on complex, multi-composition systems.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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