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High-temperature Oxidation of Metallic Alloys for SOFC Interconnects: Stress and Morphological Developments during Oxide Scale Growth

Published online by Cambridge University Press:  31 January 2011

Audric Saillard
Affiliation:
audric@gatech.edu, Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, Georgia, United States
Mohammed Cherkaoui
Affiliation:
mcherkaoui@me.gatech.edu, Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, Georgia, United States
Laurent Capolungo
Affiliation:
laurentc@lanl.gov, Los Alamos National Laboratory, Materials Science and Technology Division, Los Alamos, New Mexico, United States
Esteban P. Busso
Affiliation:
Esteban.Busso@ensmp.fr, Mines ParisTech, Centre des Matériaux, Evry, France
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Abstract

This work investigates the critical stress and morphological evolutions which occur during the high-temperature oxidation of metallic alloys for SOFC interconnects. Two mechanisms of stress generation are considered related to (1) the local volume change associated with the direct oxidation of the metal and to (2) a secondary oxidation process within grain boundaries. A specific formulation is developed to include the influence of the stress state at the metal-oxide interface on the local oxidation kinetics. The oxidation of a chromia-forming SOFC interconnect metallic alloy is simulated and stress and morphological evolutions are investigated.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

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High-temperature Oxidation of Metallic Alloys for SOFC Interconnects: Stress and Morphological Developments during Oxide Scale Growth
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High-temperature Oxidation of Metallic Alloys for SOFC Interconnects: Stress and Morphological Developments during Oxide Scale Growth
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