Skip to main content Accessibility help
×
Home
Hostname: page-component-747cfc64b6-ngm8v Total loading time: 0.144 Render date: 2021-06-14T13:38:56.320Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": true, "newCiteModal": false, "newCitedByModal": true, "newEcommerce": true }

Grain Growth Suppression and Enhancement by Interdiffusion in Thin Films

Published online by Cambridge University Press:  15 February 2011

Alexander H. King
Affiliation:
Department of Materials Science & Engineering, State University of New York at Stony Brook, Stony Brook, NY 11794–2275, U. S. A.
Karen E. Harris
Affiliation:
Department of Materials Science & Engineering, State University of New York at Stony Brook, Stony Brook, NY 11794–2275, U. S. A.
Get access

Abstract

Grain structure and grain growth in thin metallic films are important because of their effects on properties such as yield strength, electrical resistance and electromigration resistance. Since almost all thin films are used in contact with a substrate and many also have contacts with overlayers, it is important to consider how interactions with other materials affect the grain growth process. In this paper we consider the effects of diffusive interactions. We will show that interdiffusion often accompanies grain growth and that it can result in a number of novel grain boundary reactions, driven by a variety of effects. Using TEM techniques, we demonstrate cases of grain growth suppression and grain growth enhancement resulting from interdiffusion of solute atoms in gold thin films. The reasons for the observed effects will be considered with a view to providing a fundamental understanding of the types of systems that might be expected to exhibit the various phenomena.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below.

References

1. Smith, D.A., Rae, C.M.F. and Grovenor, C.R.M. in Grain Boundary Structure and Kinetics, Ed. Balluffi, R.W., ASM, Metals Park OH (1980) p.337 Google Scholar
2. Harrison, L.G., Trans. Faraday Soc., 57, 1191 (1957).CrossRefGoogle Scholar
3. Hu, J. and Seidman, D.N., Scripta Metall. Mater., 27, 693 (1991).CrossRefGoogle Scholar
4. Swiatnicki, W., Lartigue-Korinek, S., Dubon, A. and Laval, J.Y., Mater. Sci. For. 126128, 193 (1993).Google Scholar
5. Jahn, R.J. and King, A.H., Acta Metall. Mater., 40, 551 (1992).CrossRefGoogle Scholar
6. Bollmann, W., Michaut, G. and Sainfort, G.., Phys. Stat. Sol. (a), 13, 637 (1972).CrossRefGoogle Scholar
7. Read, W.T. and Shockley, W., Phys. Rev. 78, 275 (1950).CrossRefGoogle Scholar
8. King, A.H., Int. Mater. Revs. 32, 173 (1987).CrossRefGoogle Scholar
9. Pan, J.D. and Balluffi, R.W., Acta Metall. 30, 861 (1982).CrossRefGoogle Scholar
10. Chongmo, Li and Hillert, M., Acta Metall. 29, 1949 (1981).CrossRefGoogle Scholar
11. Hillert, M., Scripta Metall. 17, 237 (1983).CrossRefGoogle Scholar
12. Rhee, W.H., Song, Y.D. and Yoon, D.N., Acta Metall. 34, 2039 (1986).Google Scholar
13. Chen, F.S., Dixit, G., Aldykiewicz, A.J. Jr. and King, A.H., Met. Trans. A 21, 2363 (1990).CrossRefGoogle Scholar
14. Chaudhari, P., J. Vac. Sci. Technol., 9, 520 (1971).CrossRefGoogle Scholar
15. Mullins, W.W., Acta Metall., 6, 414 (1958).CrossRefGoogle Scholar
16. Goyal, D. and King, A.H., J. Mater. Res., 7, 359 (1992).CrossRefGoogle Scholar
17. Harris, K.E. and King, A.H., J, Elec. Mater., to be published.Google Scholar
18. Kaur, I., Gust, W. and Kozma, L., Handbook of Grain and Interphase Boundary Diffusion Data, University of Stuttgart, 1989.Google Scholar
19. Rutter, J.W. and Aust, K.T., Acta Metall., 6, 375 (1958).CrossRefGoogle Scholar

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Grain Growth Suppression and Enhancement by Interdiffusion in Thin Films
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Grain Growth Suppression and Enhancement by Interdiffusion in Thin Films
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Grain Growth Suppression and Enhancement by Interdiffusion in Thin Films
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *