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Film Stress Characterization Using Substrate Shape Data and Numerical Techniques

Published online by Cambridge University Press:  11 February 2011

Zhaohua Feng
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department, University of Wisconsin, Madison, WI 53706, U.S.A.
Edward G. Lovell
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department, University of Wisconsin, Madison, WI 53706, U.S.A.
Roxann L. Engelstad
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department, University of Wisconsin, Madison, WI 53706, U.S.A.
Andrew R. Mikkelson
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department, University of Wisconsin, Madison, WI 53706, U.S.A.
Phillip L. Reu
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department, University of Wisconsin, Madison, WI 53706, U.S.A.
Jaewoong Sohn
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department, University of Wisconsin, Madison, WI 53706, U.S.A.
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Abstract

Intrinsic stress in a film-substrate system can have deleterious effects. To facilitate an understanding of stress generation and control film quality, measuring film stress is essential. In recent years research laboratories and industry have increasingly adopted indirect methods, which are usually based on the measurement of substrate deformation. The film stress is calculated by equations relating the stress to the deformation, such as the well-known Stoney's equation. However, when the two principal stresses at each point in the film plane are not equal and their distribution is nonuniform, the local application of Stoney's equation does not provide correct stress results. A numerical technique is presented, which overcomes these limitations and makes accurate stress determination possible.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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References

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