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Fabrication of Micro-OLEDs by Room-temperature Curing Nanocontact-print Lithography Using DLC Molds

Published online by Cambridge University Press:  07 January 2013

Ippei Ishikawa
Affiliation:
Electric and Control System Engineering Course, Faculty of Advanced Engineering, Maizuru National College of Technology, 234 Shiroya, Maizuru, Kyoto 625-8511, Japan
Keisuke Sakurai
Affiliation:
Electric and Control System Engineering Course, Faculty of Advanced Engineering, Maizuru National College of Technology, 234 Shiroya, Maizuru, Kyoto 625-8511, Japan
Shuji Kiyohara
Affiliation:
Electric and Control System Engineering Course, Faculty of Advanced Engineering, Maizuru National College of Technology, 234 Shiroya, Maizuru, Kyoto 625-8511, Japan
Taisuke Okuno
Affiliation:
Electric and Control System Engineering Course, Faculty of Advanced Engineering, Maizuru National College of Technology, 234 Shiroya, Maizuru, Kyoto 625-8511, Japan
Hideto Tanoue
Affiliation:
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, 1-1 Hibarigaoka Tenpaku, Toyohashi, Aichi 441-8580, Japan
Yoshiyuki Suda
Affiliation:
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, 1-1 Hibarigaoka Tenpaku, Toyohashi, Aichi 441-8580, Japan
Hirofumi Takikawa
Affiliation:
Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, 1-1 Hibarigaoka Tenpaku, Toyohashi, Aichi 441-8580, Japan
Yoshio Taguchi
Affiliation:
Application and Technical Section, ELIONIX INC., 3-7-6 Motoyokoyama, Hachioji, Tokyo 192-0063, Japan
Yoshinari Sugiyama
Affiliation:
Application and Technical Section, ELIONIX INC., 3-7-6 Motoyokoyama, Hachioji, Tokyo 192-0063, Japan
Yukiko Omata
Affiliation:
Application and Technical Section, ELIONIX INC., 3-7-6 Motoyokoyama, Hachioji, Tokyo 192-0063, Japan
Yuichi Kurashima
Affiliation:
Research Center for Ubiquitous MEMS and Micro Engineering,AIST,1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
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Abstract

The microfabrication technologiesfor organic light-emitting devices (OLEDs) are essential to the fabrication of the next generation of light-emitting devices. The micro-OLEDs fabricated by room-temperature curing nanoimprint lithography (RTC-NIL) using diamond molds have been investigated. However, light emissions from 10 μm-square-dot OLEDs fabricated by the RTC-NIL method have not been uniform. Therefore, we proposed the fabrication of micro-OLEDs by room-temperature curing nanocontact-print lithography (RTC-NCL) using the diamond-like carbon (DLC) mold. The DLC molds used in RTC-NCL were fabricated by an electron cyclotron resonance (ECR) oxygen ion shower with polysiloxane oxide mask in electron beam (EB) lithography technology. The mold patterns are square and rectangle dots which has 10 µm-width, 10 µm-width and50 µm-length, respectively. The height of the patterns is 500 nm. The DLC molds were used to form the insulating layer of polysiloxane in RTC-NCL. We carried out the RTC-NCL process using the DLC mold under the following optimum conditions: 0.1 MPa-pressure for coating DLC mold with polysiloxane film, 2.1 MPa-pressure for transferring polysiloxane from DLC mold pattern to indium tin oxide (ITO) glass substrate. We deposited N, N'-Diphenyl -N, N'-di (m-tolyl)benzidine (TPD) [40 nm-thickness] as hole transport layer / Tris(8-quinolinolato)aluminum (Alq3) [40 nm-thickness] as electron transport layer / Al [200 nm-thickness] as cathode on ITO glass substrateas anode in this order. We succeeded in formation of the insulating layer with square and rectangle dots which has 10 µm-width,10 µm-width and 50 µm-length, and operation of micro-OLEDs by RTC-NIL using DLC molds.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

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