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Experimental Characterization of Material Properties of 63Sn37Pb Flip Chip Solder Joints

Published online by Cambridge University Press:  10 February 2011

S. Wiese ,
F. Feustel ,
S. Rzepka  and
E. Meusel
S. Wiese
Affiliation:
Dept.of Electrical Engineering, Dresden University of Technology, Germany TU Dresden, IHM, D-01062 Dresden, wiese@ehmgw I.et.tu-dresden.de
F. Feustel
Affiliation:
Dept.of Electrical Engineering, Dresden University of Technology, Germany TU Dresden, IHM, D-01062 Dresden, wiese@ehmgw I.et.tu-dresden.de
S. Rzepka
Affiliation:
Dept.of Electrical Engineering, Dresden University of Technology, Germany TU Dresden, IHM, D-01062 Dresden, wiese@ehmgw I.et.tu-dresden.de
E. Meusel
Affiliation:
Dept.of Electrical Engineering, Dresden University of Technology, Germany TU Dresden, IHM, D-01062 Dresden, wiese@ehmgw I.et.tu-dresden.de
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Abstract

The paper presents new material data of real flip chip solder joints. A testing apparatus was designed to perform reversible shear tests on flip chip joints. In contrast to previous test setups for similar purposes this tester provides an infinite stiffness, a very high precision force (1 mN resolution) and displacement (20 nm resolution) measurement. The experimental program included cyclic shear tests for elastic plastic material data as well as a newly developed reversal creep and relaxation test for time depended material properties. A subsequent FEM simulation was applied to evaluate experimental raw data and to determine the parameters of material models provided by ANSYSTM. A user defined creep model had been added to the source code, in order to receive a convenient solder model for FE-Analysis of SnPb37 flip chip solder joints under thermomechanical stresses in electronic packages. The results of this study shows that the material behavior of flip chip solder joints is much more like that of bulk samples with a comparable micro structure than it is commonly believed up to now, because of the previously published data.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 233
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

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