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Electrical Contact Characteristics between Silicon Micropillars and Ag Nanoparticles with Controlled Mechanical Load

Published online by Cambridge University Press:  31 October 2012

VJ Logeeswaran
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616.
Mark Triplett
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616. Department of Physics, University of California-Davis, CA 95616.
Daniel Lam
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616.
Emre Yengel
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616.
Heim Grewal
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616.
Matthew Ombaba
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616.
M. Saif Islam
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616.
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Abstract

We report an experimental investigation on employing Ag nanoparticles to provide electrical and mechanical contacts between transfer-printed semiconductor devices in the shape of micro/nano- wires and pillars. The Ag nanoparticles have diameters ranging between 200-800nm and are assembled on a 200nm Au film deposited on glass substrates. With a customized tool, an ensemble of silicon pillars were brought into contact with the silver (Ag) nanoparticles (AgNPs) by precisely controlling the displacement and applied force (pressure). Current-voltage measurements were done at force resolution of ~0.2N. The test method aims to illuminate the pillar-particle contact mechanism using the nanoparticles as conductive fillers for the next generation of high performance heteroepitaxial device transfer-printing applications.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

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References

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