Skip to main content Accessibility help
×
Home
Hostname: page-component-768dbb666b-v9bzm Total loading time: 0.38 Render date: 2023-02-03T01:36:47.366Z Has data issue: true Feature Flags: { "useRatesEcommerce": false } hasContentIssue true

Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias

Published online by Cambridge University Press:  01 February 2011

Jin Hyun
Affiliation:
Eco-Nano Research Center, Korea Institute of Science and Technology, P.O. Box 131, Cheongyang Seoul 130–650, Korea
Bup Ju Jeon
Affiliation:
Dept. of Materials Science & Engineering, Korea University, Seoul, 136–701, Korea
Dongjin Byun
Affiliation:
Eco-Nano Research Center, Korea Institute of Science and Technology, P.O. Box 131, Cheongyang Seoul 130–650, Korea
Joong Kee Lee
Affiliation:
Dept. of Materials Science & Engineering, Korea University, Seoul, 136–701, Korea
Get access

Abstract

Characteristics of Cu/C:H films on the PET substrate prepared by ECR-MOCVD coupled with a DC bias under Cu(hfac)2-Ar-H2 was investigated with special attention to process parameters. Our results showed that the Cu/C:H film has strongly adhere with the polymer substrate by chemical bonding and exhibited wide range of electrical conductivity that could be controlled by process parameters. The increase in H2/Ar ratio, microwave power and negative DC bias voltage brought on the higher pulling strength between Cu/C:H films and PET substrate. The effects of surface pretreatments of polymer substrate on pulling strength were insignificant in the range of our experimental range.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Bertrand, P., Lambert, P., and Travaly, Y., Nucl. Instrum. Methods, B 131, 71 (1997).CrossRefGoogle Scholar
2. Wen, Xiaogang, Zhou, Kunlin, Yong, and Cao, Weimin, Thin Solid Films 303, 146 (1997).CrossRefGoogle Scholar
3. Kersten, H.-J. and Wolf, G. K., Surface and Coatings Technology, 116–119, 1183 (1999).CrossRefGoogle Scholar
4. Lee, J.K., Ko, H., Hyun, J., Byun, D., Cho, B.W. and Park, D., Mat. Res. Soc. Symp. Proc., B9.49.1–B.9.49.6, 734 (2003).Google Scholar
5. Yoon, S.F., Tan, K.H., Rusli, , Ahn, J., Huang, Q.F., Diamond and Related Materials, 9, 2024 (2000).CrossRefGoogle Scholar

Save article to Kindle

To save this article to your Kindle, first ensure coreplatform@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about saving to your Kindle.

Note you can select to save to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be saved to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias
Available formats
×

Save article to Dropbox

To save this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Dropbox account. Find out more about saving content to Dropbox.

Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias
Available formats
×

Save article to Google Drive

To save this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you used this feature, you will be asked to authorise Cambridge Core to connect with your Google Drive account. Find out more about saving content to Google Drive.

Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias
Available formats
×
×

Reply to: Submit a response

Please enter your response.

Your details

Please enter a valid email address.

Conflicting interests

Do you have any conflicting interests? *