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Compact Modelling of Electrical, Mechanical and Thermal Behaviour for MEMS with SPICE

Published online by Cambridge University Press:  01 February 2011

Andreas Frank
Affiliation:
andreas.frank@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany, +49(0)367769-1590, +49(0)367769-3132
J.-P. Zoellner
Affiliation:
jens-peter.zoellner@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
Y. Sarov
Affiliation:
yanko.sarov@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
Tz. Ivanov
Affiliation:
tzvetan.ivanov@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
I. Kuhnholz
Affiliation:
ingo.kuhnholz@stud.tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
St. Klett
Affiliation:
stefan.klett@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
I. W. Rangelow
Affiliation:
ivo.rangelow@tu-ilmenau.de, TU-Ilmenau, Micro- and nanoelectronic systems, Gustav-Kirchoff-Str. 1, Ilmenau, 98693, Germany
M. Swiatkowski
Affiliation:
teodor.gotszalk@pwr.wroc.pl, Wroclaw Technical University, Wroclaw, 50372, Poland
T. Gotszalk
Affiliation:
teodor.gotszalk@pwr.wroc.pl, Wroclaw Technical University, Wroclaw, 50372, Poland
N. Nikolov
Affiliation:
nn6210@abv.bg, Microsystems Ltd., Varna, 9010 P.O. Box 147, Bulgaria
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Abstract

In this paper we present a novel method of nonlinear macro model of a cantilever for mixed domain simulation only with SPICE. Based on lumped elements of equivalent circuits a model is developed, which realizes a coupled electro-thermal-mechanical simulation including crosstalk effects. The model is verified with measurement and helps to class and solve crosstalk. With SPICE as electrical circuit simulator the cantilever array could be simulate in conjunction with the excitations and analysis electronics more detailed like the system level models and faster like FEM-simulation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

1. Rangelow, I. W. et al., Microelectronic Engineering 83 (2006), 14491455.CrossRefGoogle Scholar
2. Mehner, J., “Entwurf in der Mikrosystemtechnik“, Dresden Univ. Press. 2000, ISBN 3-931828-47-6.Google Scholar
3. Schlegel, M., Bennini, F., Mehner, J.E., Herrman, G., Müller, G. and Dotzel, W., Sensors Journal, IEEE vol. 5, no 5 (2005) 10191026.CrossRefGoogle Scholar
4. Iannacci, J., Gaddi, R., Gnudi, A., Mircowave Integrated Circuit Conference 2007, 544547.Google Scholar
5. Verd, J et al., Proc. SPIE Int. Soc. Opt. Eng. 5836, 98 (2005).Google Scholar
6. Kuijk, J. van, Schropfer, G., daSilva, M., Conventor, Design, Automation, and Test in Europe, 2005 Munich.Google Scholar
7. Mukherjee, T., Fedder, G. K., J. VLSI Signal Process. Syst 21 (1999), 233249.CrossRefGoogle Scholar
8. Senturia, S. D.: “Microsystem Design“, Kluwer Acedemic Publishers 2001. ISBN-0-7923-7246-8Google Scholar
9. Rudnyi, E. B., Korvink, J. G., Sensors Update 11 (2002), 333.CrossRefGoogle Scholar
10. Balk, I. “Arnoldy based passive model order reduction algorithm”, www.intellisensesoftware.com/.Google Scholar
11. Diener, K.-H., et. al., 22nd CAD-FEM Users Meeting 2004, Dresden, November 10-12, 2004.Google Scholar
12. Tilmann, H., J. Micromech. Microeng. 7 (1997) 285309.CrossRefGoogle Scholar
13. Veijola, T., Mattila, T., Intern. J. of RF and Microwave CAD 11 no. 5 (2001) 310321.CrossRefGoogle Scholar
14. Pedrak, R. at all., J. Vac. Sci. Technol. B 21.6., (2003), 31023107.CrossRefGoogle Scholar
15. Ivanov, Tzv., PhD Thesis (2004)Google Scholar
16. Hosaka, H., Itao, K., Kuroda, S., Sensors and Actuators. A49 (1995) 8795.CrossRefGoogle Scholar
17. Frank, A. et al., Parasitic effects in self-actuated piezoresistive cantilever arrays; will be published.Google Scholar

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Compact Modelling of Electrical, Mechanical and Thermal Behaviour for MEMS with SPICE
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