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Charactervation of Adhesion in Thin-Film Materials by the Blister Test

Published online by Cambridge University Press:  15 February 2011

Y Z. Chu ,
H. S. Jeong ,
R. C. White  and
C. J. Durning
Y Z. Chu
Affiliation:
Department of Chemical Engineering and Applied Chemistry, Columbia University, New York, NY 10027
H. S. Jeong
Affiliation:
Department of Electrical Engineering, Columbia University, New York, NY 10027.
R. C. White
Affiliation:
Department of Electrical Engineering, Columbia University, New York, NY 10027.
C. J. Durning
Affiliation:
Department of Chemical Engineering and Applied Chemistry, Columbia University, New York, NY 10027
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Abstract

In this work a blister test is applied to study the adhesion of thin films to substrates. In the blister test one injects a fluid at constant rate at the interface between the substrate and an overlayer to create a “blister”. The fluid pressure is measured as function of time. An analysis gives a reliable way of calculating the adhesion energy Ga. from the time-dependent pressure data. The method was applied to a variety of systems including polymer/polymer, polymer/silicon and polymer/metal interfaces. The results show that the test is very sensitive and is able to determine small adhesion energies inaccessible in conventional peel tests. This work demonstrates that the blister test provides a means of relating the mechanical strength of an interface to its microscopic dynamic and structural features.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 276: Symposia U/Y – Smart Materials Fabrication and Materials for Micro-Electro-Mechanical Systems , 1992 , 209
Copyright
Copyright © Materials Research Society 1992

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References

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