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Characterization of a Rapid Thermal Annealed TiNxOy/TiSi2 Barrier Layer
Published online by Cambridge University Press: 25 February 2011
Abstract
In this paper we characterize the thin film formed by rapid thermal anneal of a magnetron sputtered titanium film in a nitrogen atmosphere. The barrier properties of this material have been characterized for both n- and p-type junctions in our CMOS technology. We have characterized the physical properties of the film using Auger, RBS and TEM analysis in the same range of temperatures, and find that as the annealing temperature is increased a better quality TiNxOy film is formed. The electromigration characteristics for Aℓ/TiNxOy/TiSi2 runners, as well as the role that this system plays in minimizing failures due to stress induced voiding are examined in this study.
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- Copyright © Materials Research Society 1990
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