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The characteristics of the Electrolyzed D.I.water with chemicals and the outline of the supply system

Published online by Cambridge University Press:  14 March 2011

Mitsuhiko Shirakashi
Affiliation:
Precision Machinery Group, Ebara Corporation 4-2-1, Honfujisawa, Fujisawa-shi, Kanagawa 251-8502, Japan
Kenya Itoh
Affiliation:
Precision Machinery Group, Ebara Corporation 4-2-1, Honfujisawa, Fujisawa-shi, Kanagawa 251-8502, Japan
Ichiro Katakabe
Affiliation:
Precision Machinery Group, Ebara Corporation 4-2-1, Honfujisawa, Fujisawa-shi, Kanagawa 251-8502, Japan
Mamabu Tsujimura
Affiliation:
Precision Machinery Group, Ebara Corporation 4-2-1, Honfujisawa, Fujisawa-shi, Kanagawa 251-8502, Japan
Takayuki Saitoh
Affiliation:
Center of Technology Development, Ebara Research CO., Ltd. 4-2-1, Honfujisawa, Fujisawa-shi, Kanagawa 251-8502, Japan
Kaoru Yamada
Affiliation:
Center of Technology Development, Ebara Research CO., Ltd. 4-2-1, Honfujisawa, Fujisawa-shi, Kanagawa 251-8502, Japan
Naoto Miyashita
Affiliation:
Manufacturing Engineering Center, Toshiba Corporation Semiconductor Company 8, Shinsugita-cho, Isogo-ku, Yokohama, Kanagawa 235-8522, Japan
Masako Kodera
Affiliation:
Manufacturing Engineering Center, Toshiba Corporation Semiconductor Company 8, Shinsugita-cho, Isogo-ku, Yokohama, Kanagawa 235-8522, Japan
Yoshitaka Matsui
Affiliation:
Manufacturing Engineering Center, Toshiba Corporation Semiconductor Company 8, Shinsugita-cho, Isogo-ku, Yokohama, Kanagawa 235-8522, Japan
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Abstract

In semiconductor device production, wafers are treated through many cleaning processes. Usually, several chemicals are used so as to match for several purposes like RCA cleaning method. As wafer size becomes larger, large amount of cleaning chemicals usage and waste are necessary, which becomes now a big problem. Considering the above, we developed the Electrolyzed D.I.water with chemicals supply system in order to minimize running cost of chemicals and waste treatment. It is feature that; 1) this system can generate the anode water of the acidity/high ORP (Oxidation-Reduction Potential) and the cathode water of the alkalinity/low ORP by electrolyzing D.I.water adding with a small quantity of chemicals; 2) this system can generate anode water and cathode water at the same time; 3) if necessary, the anode water can be diluted with D.I.water at the optional density, and it is possible with the cathode water that hydrogen peroxide is added. The anode water which shows acidity/high ORP has the effect of removing metal and organic contamination, and the cathode water which shows alkalinity/low ORP has the effect of particle removal. In this report, we explain the outline of this system and the basic characteristic of the Acid and Alkaline water made with this system and its performances.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

Kashiwagi, M. Hattori, A.: ”Cleaning technology of wafer surface”, Realize INC.Google Scholar