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Barrier Effect on Electroplated Cu Films
Published online by Cambridge University Press: 10 February 2011
Abstract
The effect of various barrier materials on the microstructure of electroplated Copper films was investigated. Analysis of the Cu was performed at the as-deposited, room temperature stabilized, and annealed states. It shows that the barrier material can have a dramatic effect on the properties of electroplated Cu.
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- Copyright © Materials Research Society 1999