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3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces

Published online by Cambridge University Press:  01 February 2011

Jian-Qiang Lu
Affiliation:
luj@rpi.edu, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Systems Engineering; Center for Integrated Electronics, Troy, New York, United States
J. Jay McMahon
Affiliation:
j.jay.mcmahon@gmail.com, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Systems Engineering; Center for Integrated Electronics, Troy, New York, United States
Ronald J. Gutmann
Affiliation:
gutmar@rpi.edu, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Systems Engineering; Center for Integrated Electronics, Troy, New York, United States
Corresponding
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Abstract

Three-dimensional (3D) integration is an emerging technology that vertically stacks and interconnects multiple materials, technologies and functional components to form highly integrated micro/nano-systems. This paper reviews the materials and technologies for three wafer bonding approaches to 3D integration using adhesive, metal, and metal/adhesive as the bonding interfaces. Similarities and differences in architectural advantages and technology challenges are presented, with recent research advances discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

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