Hostname: page-component-8448b6f56d-qsmjn Total loading time: 0 Render date: 2024-04-25T05:54:48.211Z Has data issue: false hasContentIssue false

4H-SIC Dmosfets for High Frequency Power Switching Applications

Published online by Cambridge University Press:  01 February 2011

Sei-Hyung Ryu
Affiliation:
Cree, Inc., 4600 Silicon Drive Durham, NC 27703
Anant K. Agarwal
Affiliation:
Cree, Inc., 4600 Silicon Drive Durham, NC 27703
James Richmond
Affiliation:
Cree, Inc., 4600 Silicon Drive Durham, NC 27703
John W. Palmour
Affiliation:
Cree, Inc., 4600 Silicon Drive Durham, NC 27703
Get access

Abstract

Very high critical field, reasonable bulk electron mobility, and high thermal conductivity make 4H-Silicon carbide very attractive for high voltage power devices. These advantages make high performance unipolar switching devices with blocking voltages greater than 1 kV possible in 4H-SiC. Several exploratory devices, such as vertical MOSFETs and JFETs, have been reported in SiC. However, most of the previous works were focused on high voltage aspects of the devices, and the high speed switching aspects of the SiC unipolar devices were largely neglected. In this paper, we report on the static and dynamic characteristics of our 4H-SiC DMOSFETs. A simple model of the on-state characteristics of 4H-SiC DMOSFETs is also presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Bhatnagar, M. and Baliga, B. J., “Comparison of 6H-SiC, 3C-SiC, and Si for power devices,” IEEE Transactions on Electron Devices, Vol. 40, p. 645655, March 1993.Google Scholar
[2] http://www.ecn.purdue.edu/WBG/Google Scholar
[3] Tan, J., Cooper, J. A. Jr , and Melloch, M. R., “High-Voltage Accumulation-Layer UMOSFETs in 4H-SiC,” IEEE Electron Device Letters, Vol. 19, 487489, December 1998.Google Scholar
[4] Peters, D., Schorner, R., Friedrichs, P., Volkl, J., Mitlehner, H., Stephani, D., “An 1800 V triple implanted vertical 6H-SiC MOSFET,” IEEE Transactions on Electron Devices, vol.46, no.3, March 1999, pp.542545.Google Scholar
[5] Schaffer, W. J., Negley, G. H., Irvine, K. G., and Palmour, J. W., “Conductivity Anistropy In Epitaxial 6H and 4H SiC,” Mat. Res. Soc. Symp. Proc. Vol. 339 (1994), pp. 595600.Google Scholar
[6] Chung, G. Y., Tin, C. C., Williams, J. R., McDonald, J. K., Ventra, M. Di, Pantelides, S. T., Feldman, L. C., Weller, R. A., “Effect of nitric oxide annealing on the interface trap densities near the band edges in the 4H polytype of silicon carbide,” Applied Physics Letters, 76(13) pp. 17131715, March 2000.Google Scholar
[7] Lipkin, L. A., Das, M. K., and Palmour, J. W., “N2O Processing Improves the 4H-SiC:SiO2 Interface,” Materials Science Forum, Vols 389-393 (2002), pp. 985988.Google Scholar