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Resistive-nanoindentation: contact area monitoring by real-time electrical contact resistance measurement

Published online by Cambridge University Press:  07 June 2019

Solène Comby-Dassonneville
Affiliation:
Univ. Grenoble Alpes, CNRS, Grenoble INP, SIMaP, 38000 Grenoble, France
Fabien Volpi*
Affiliation:
Univ. Grenoble Alpes, CNRS, Grenoble INP, SIMaP, 38000 Grenoble, France
Guillaume Parry
Affiliation:
Univ. Grenoble Alpes, CNRS, Grenoble INP, SIMaP, 38000 Grenoble, France
Didier Pellerin
Affiliation:
Scientec/CSInstruments, 91940 Les Ulis, France
Marc Verdier
Affiliation:
Univ. Grenoble Alpes, CNRS, Grenoble INP, SIMaP, 38000 Grenoble, France
*
Address all correspondence to Fabien Volpi at fabien.volpi@simap.grenoble-inp.fr
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Abstract

In the past decades, efforts have been made to couple nanoindentation with resistive measurements in order to monitor the real-time contact area, as an alternative to the use of traditional analytical models. In this work, a novel and efficient stand-alone method is proposed to compute the contact area using resistive-nanoindentation of noble metals (bulk or thin films). This method relies on three steps: tip shape measurement, set-up calibration, application to the sample to be characterized. The procedure is applied to nanoindentation tests on a sample with film-on-elastic-substrate rheology and is successfully validated against experimental measurements of the contact area.

Type
Research Letters
Copyright
Copyright © Materials Research Society 2019 

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References

1.Nili, H., Kalantar-Zadeh, K., Bhaskaran, M., and Sriram, S.: In situ nanoindentation: probing nanoscale multifunctionality. Prog. Mater. Sci. 58, 1 (2013) https://doi.org/10.1016/j.pmatsci.2012.08.001.Google Scholar
2.Clarke, D.R., Kroll, M., Kirchner, P.D., Cook, R.F., and Hockey, B.J.: Amorphization and conductivity of silicon and germanium induced by indentation. Phys. Rev. Lett. 60, 2156 (1988) https://doi.org/10.1103/PhysRevLett.60.2156.Google Scholar
3.Pharr, G.M., Oliver, W.C., Cook, R.F., Kirchner, P.D., Kroll, M., and Dinger, T.R.: Electrical resistance of metallic contacts on silicon and germanium during indentation. J. Mater. Res. 7, 961 (1992) https://doi.org/10.1557/JMR.1992.0961.Google Scholar
4.Mann, A.B., van Heerden, D., Pethica, J.B., and Weihs, T.P.: Size-dependent phase transformation during point loading of silicon. J. Mater. Res. 15, 1754 (2000) https://doi.org/10.1557/JMR.2000.0253.Google Scholar
5.Mann, A.B., van Heerden, D., Pethica, J.B., Bowes, P., and Weihs, T.P.: Contact resistance and phase transformation during nanoindentation of silicon. Philos. Mag. A 82, 1921 (2002) https://doi.org/10.1080/01418610208235704.Google Scholar
6.Bradby, J.E., Williams, J.S., and Swain, M.V.: In situ electrical characterisation of phase transformation in Si during indentation. Phys. Rev. 67, 085205 (2003) https://doi.org/10.1103/PhysRevB.67.085205.Google Scholar
7.Ruffell, S., Bradby, J.E., Williams, J.S., and Warren, O.L.: An in situ electrical measurement technique via a conducting diamond tip for nanoindentation in silicon. J. Mater. Res. 22, 578 (2007) https://doi.org/10.1557/jmr.2007.0100.Google Scholar
8.Ruffell, S., Bradby, J.E., Fujisawa, N., and Williams, J.S.: Identification of nanoindentation-induced phase changes in silicon by in situ electrical characterization. J. Appl. Phys. 101, 083531 (2007) https://doi.org/10.1063/1.2724803.Google Scholar
9.Pethica, J.B. and Tabor, D.: Contact of characterised metal surface at very low loads: deformation and adhesion. Surf. Sci. 89, 189 (1979) https://doi.org/10.1016/0039-6028(79)90606-X.Google Scholar
10.Stauffer, D.D., Major, R.C., Vodnick, D., Thomas, J.H., Parkern, J., Manno, M., Leighton, C., and Gerberich, W.W.: Plastic response of the native oxide on Cr and Al thin films from in situ conductive nanoindentation. J. Mater. Res. 27, 685 (2012) https://doi.org/10.1557/jmr.2011.432.Google Scholar
11.Nguyen, H.H., Wei, P.J., and Lin, J.F.: Electrical contact resistance for monitoring nanoindentation-induced delamination. Adv. Nat. Sci.: Nanosci. Nanotechnol. 2, 015007 (2011) https://doi.org/10.1088/2043-6262/2/1/015007.Google Scholar
12.Duvivier, P.Y., Mandrillon, V., Inal, K., Dieppedale, C., Deldon-Martoscia, S., and Polizzi, J.P.: Time dependence investigation of the electrical resistance of Au/Au thin film micro contacts. Proc. 56th IEEE Holm Conf. Elect. Cont. 58 (2010) https://doi.org/10.1109/HOLM.2010.5619563.Google Scholar
13.Arrazat, B., Duvivier, P.Y., Mandrillon, V., and Inal, K.: Discrete analysis of gold surface asperities deformation under spherical nano-indentation towards electrical contact resistance calculation. Proc. 57th IEEE Holm Conf. Elect. Cont. 1, (2011) https://doi.org/10.1109/HOLM.2011.6034798.Google Scholar
14.Fang, L., Muhlstein, C.L., Collins, J.G., Romasco, A.L., and Friedman, L.H.: Continuous electrical in situ contact area measurement during instrumented indentation. J. Mater. Res. 23, 2480 (2008) https://doi.org/10.1557/jmr.2008.0298.Google Scholar
15.Sprouster, D.J., Ruffel, S., Bradby, J.E., Stauffer, D.D. and Major, R.C., Warren, O.L., and Williams, J.S.: Quantitative electromechanical characterization of materials using conductive ceramic tips. Acta Mater. 71, 153 (2014) https://doi.org/10.1016/j.actamat.2014.02.028.Google Scholar
16.Sneddon, I.N.: The relation between load and penetration in the axisymmetric boussinesq problem for a punch of arbitrary profile. Int. J. Eng. Sci., 3, 47 (1965) https://doi.org/10.1016/0020-7225(65)90019-4.Google Scholar
17.Oliver, W.C. and Pharr, G.M.: Measurements of hardness and elastic modulus by instrumented indentation: advances in understanding and refinements to methodology. J. Mater. Res. 19, 3 (2004) http://dx.doi.org/10.1557/jmr.2004.0002.Google Scholar
18.Oliver, W.C. and Pharr, G.M.: An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7, 1564 (1992) https://doi.org/10.1557/JMR.1992.1564.Google Scholar
19.Loubet, J.L., Bauer, M., Tonck, A., Bec, S., and Gauthier-Manuel, B.: Mechanical properties and deformation behavior of materials having ultra-fine microstructures: nanoexperiments with a surface force apparatus. In Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures, edited by Nastasi, M., Parkin, D.M. and Gleiter, H. (Springer Netherlands, Dordrecht 429, 1993) https://doi.org/10.1007/978-94-011-1765-4.Google Scholar
20.Houzé, F., Meyer, R., Schneegans, O., and Boyer, L.: Imaging the local electrical properties of metal surfaces by atomic force microscopy with conducting probes. Appl. Phys. Lett. 69, 1975 (1996) https://doi.org/10.1063/1.117179.Google Scholar
21.Gwyddion software. Available at: http://gwyddion.net/download.php (accessed 14 May 2019).Google Scholar
22.Charleux, L., Keryvin, V., Nivard, M., Guin, J.-P., Sangleboeuf, J.-C., and Yokoyama, Y.: A method for measuring the contact area in instrumented indentation testing by tip scanning probe microscopy imaging, Acta Mat. 70, 249258 (2014) https://doi.org/10.1016/j.actamat.2014.02.036.Google Scholar
23.Schneegans, O., Chrétien, P., Houzé, F., and Meyer, R.: Capacitance measurements on small parallel plate capacitors using nanoscale impedance microscopy. Appl. Phys. Lett. 90, 043116 (2007) https://doi.org/10.1063/1.2437052.Google Scholar
24.Romano, J.D. and Price, R.H.: The conical resistor conundrum: a potential solution. Am. J. Phys., 64, 1150 (1996) https://doi.org/10.1119/1.18335.Google Scholar
25.Nakamura, M.: Constriction resistance of conducting spots by the boundary element method. IEEE Trans. Comp. Hybrids, Manufact. Technol. 16, 339 (1993) https://doi.org/10.1109/33.232062.Google Scholar
26.Sharvin, Y.: A possible method for studying Fermi surfaces. Sov. Phys. JETP 21, 655 (1965).Google Scholar
27.Greenwood, J.A.: Constriction resistance and the real area of contact. J. Appl. Phys. 17, 1621 (1966) https://doi.org/10.1088/0508-3443/17/12/310.Google Scholar
28.Perriot, A. and Barthel, E.: Elastic contact to a coated half-space-effective elastic modulus and real penetration. J. Mater. Res. 19, 600 (2004) https://doi.org/10.1557/jmr.2004.19.2.600.Google Scholar
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