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Characteristics of nickel thin films prepared by electroless plating in foam of electrolyte

Published online by Cambridge University Press:  06 November 2017

Takahiro Furuhashi ,
Yoshiyasu Yamada ,
Masato Hayashi ,
Shoji Ichihara  and
Hiroaki Usui
Takahiro Furuhashi
Affiliation:
Yamada Co. Ltd., Ryouke, Naka-ku, Hamamatsu, Shizuoka 430-0852, Japan
Yoshiyasu Yamada
Affiliation:
Yamada Co. Ltd., Ryouke, Naka-ku, Hamamatsu, Shizuoka 430-0852, Japan
Masato Hayashi
Affiliation:
Division of Applied Chemistry, Institute of Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Naka-cho, Koganei, Tokyo 184-8588, Japan
Shoji Ichihara
Affiliation:
Division of Applied Chemistry, Institute of Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Naka-cho, Koganei, Tokyo 184-8588, Japan
Hiroaki Usui*
Affiliation:
Division of Applied Chemistry, Institute of Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Naka-cho, Koganei, Tokyo 184-8588, Japan
*
Address all correspondence to Hiroaki Usui at h_usui@cc.tuat.ac.jp
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Abstract

Nickel thin films were prepared by electroless plating in a foam of electrolyte that was generated by bubbling nitrogen gas into a hypophosphite-based electroless plating solution to which was added a surfactant of sulfuric acid monododecyl ester sodium salt. Although the film growth rate in the foam was considerably lower than that in the conventional liquid, film growth was enhanced by inducing a flow in the foam. Compared with films deposited in liquid, the films deposited in foam had a smaller number of pinholes, smaller crystallite size, and superior corrosion resistance. The ferroxyl indicator test showed that the area of corrosion can be reduced to less than 1/20 by depositing the film in foam instead of liquid.

Type
Research Letters
Information
MRS Communications , Volume 7 , Issue 4 , December 2017 , pp. 953 - 959
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Copyright
Copyright © Materials Research Society 2017 

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